Metallography, Microstructure & Analysis
Focuses on the art and science of preparing, interpreting, and analyzing microstructures to understand material behavior and performance.
A forum to exchange the latest information on the evolution and understanding of microstructures in a variety of materials.
Discusses ways microstructure can influence, or arise from:
Mechanical and thermal processing of metals, alloys and ceramics
Environmental degradation (such as oxidation and corrosion)
Welding, casting, and solidification processes
Additive or digital manufacturing techniques
Failure of engineering structures
Published by Springer. Metallography, Microstructure and Analysis is available online via SpringerLink.
As a benefit of membership, IMS members receive full text online access to Metallography, Microstructure and Analysis.
Contact the ASM Member Service Center at 800.336.5152, ext. 0 or 440.338.5151, ext. 0.
Price: $516 (IMS members $112.46 Print*, ASM members $136.60, both online and print).
*IMS members receive the online version free of charge.
If you receive access through your institution's license, rather than a personal subscription, please proceed to www.springer.com and follow the instructions provided by your institution.
View Table of Contents and Author Instructions >
Ryan M. Deacon, Editor, DuPont Engineering and Research Technologies, Wilmington, DE, USA
Elvin Beach, Associate Editor, Worthington Industries, Columbus, OH, USA
Amber M. Dalley, Associate Editor, RJ Lee Group, Ogden, Utah, USA
Chris Bagnall, Advisory Editor, MCS Associates, Greensburg, PA, USA
Günter E. Petzow, Advisor to the Board, Max Planck Institute, Germany
James E. Martinez, IMS Board Liaison to Publications Committees, NASA Lyndon B. Johnson Space Center, Houston, TX, USA
Krishan K. Chawla, University of Alabama, Birmingham, AL, USA
Daolun Chen, Ryerson University, Toronto, Canada
Sunniva Collins, Case Western Reserve University, Cleveland, OH, USA
Steve Dekanich, Y-12 National Security Complex, Oak Ridge, TN, USA
Isabel Fernandes, University of Lisbon, Portugal
Ke Lu, Chinese Academy of Sciences, China
Laura Moyer, Lehigh University, Bethlehem, PA, USA
Frank Mücklich, Saarland University, Germany
Lawrence E. Murr, University of Texas, El Paso, TX, USA
Vilupanur A. Ravi, California State Polytechnic University, Pomona, CA, USA
Tony Rollett, Carnegie Mellon University, Pittsburgh, PA,USA
Donald F. Susan, Sandia National Laboratories, Albuquerque, NM, USA
George F. Vander Voort, Vander Voort Consulting L.L.C., Wadsworth, IL, USA
Jeffrey Wadsworth, Battelle, Columbus, OH, USA