Amkor Technology completes acquisition of Nanium for its semiconductor packaging
June 18, 2017
Source: ASM International
Amkor Technology Inc., Tempe, Ariz., has completed the acquisition of Nanium S.A., Portugal, a provider of wafer-level fan-out semiconductor packaging solutions. The company says that the acquisition will strengthen its position in the fast growing market of wafer-level packaging for smartphones, tablets, and other applications. Nanium has developed a high-yielding, reliable WLFO technology, and has successfully ramped that technology to high volume production.
"Amkor is a leader in wafer-level CSP and high-density integrated fan-out technologies," said Steve Kelley, Amkor's president and chief executive officer. "With the acquisition of Nanium, we will have an equally compelling value proposition in the low-density fan-out area. Nanium is widely viewed as the fan-out technology leader as well as a very capable manufacturer, having shipped more than one billion WLFO packages utilizing a state-of-the-art 300mm wafer-level packaging production line."
Industries and Applications | Electronics