Hitachi’s Regulus field emission SEMs feature resolution down to 0.9 nanometer
June 19, 2017
Source: ASM International
Hitachi High-Technologies Corp., Japan, introduces the new Regulus series of field emission scanning electron microscopes that offer enhanced functionality with improved resolution and operability. With optimized electron optical systems, the new Regulus series features resolution down to 0.9 nm in the Regulus8220/8230/8240 models, and 1.1 nm in the Regulus8100 model—an improvement of roughly 20% in resolution at 1 kV landing voltage compared with previous models.
The Regulus series features a novel cold-field-emission (CFE) gun optimized for high-resolution imaging at low accelerating voltages. This CFE gun makes it possible to magnify high-resolution images up to two million times, compared with one million times in previous models.
User-support functions have also been enhanced, so that the advanced performance of the series can be fully leveraged. This includes functions to assist the operation of the signal detection system for analyzing diverse types of materials, as well as device-maintenance functions.
The Regulus series lineup comprises four models: the Regulus8100, developed as the successor to the SU8010; and the Regulus8220, Regulus8230, and Regulus8240, which extend the functions of the SU8200 series with the use of a common platform.
Scanning electron microscopes are used to observe material structures in a diverse range of scientific fields, including nanotechnology, semiconductors/electronics, and materials science. In recent years, cutting-edge science and technology around the world have been supported by advances in research into graphene and other new carbon materials expected to be applied to next-generation electronic devices, as well as polymeric materials and composite materials.
SEMs for observation and evaluation of these materials must have low-accelerating-voltage imaging capabilities and high-sensitivity elemental-analysis capabilities to enable observation of surface microstructures, as well as ultra-high-resolution imaging capacity.
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