Keep up-to-date on the latest advances in the metals and materials industry with ASM Industry News.
June 22, 2017The graph shows composition-depth profiles of nitrided stainless steel AISI 316 as determined with glow discharge optical emission spectrometry (GDOES).
June 21, 2017ArcelorMittal Long Products Canada, Longueuil, Quebec, has inaugurated a new$20 million finishing line at its bar mill, to increase the facility's annual rolling capacity from 400,000 to 500,000 metric tons.
June 21, 2017Lindberg/MPH, Riverside, Mich., has shipped a large-chamber utility box furnace to an automotive supplier for batch testing aluminum castings on a daily basis at a temperature of 932°F.
June 21, 2017Spirit AeroSystems, Wichita, Kan., announces a new center of excellence focusing on the fabrication of complex aluminum and titanium commercial and military aircraft parts by new five-axis machines.
June 19, 2017Leica Microsystems Inc., Buffalo Grove, Ill., has developed the DM3 XL microscope inspection system for process control or defect and failure analysis in the microelectronics and semiconductor industry.
June 19, 2017Brewer Science, Rolla, Mo., announces that its Cee semiconductor processing equipment business unit has been sold to former Brewer Science employee Russ Pagel, who has formed a new company, Cost Effective Equipment LLC, to take over ownership and operate the business.
June 19, 2017Bruker Corp., Germany, launches its S8 Tiger Series 2, the next-generation wavelength dispersive X-ray fluorescence spectrometer, said to be the most versatile WDXRF tool available for advanced quantitative elemental analysis.
June 19, 2017JEOL USA, Peabody, Mass., introduces its new compact InfiTOF mass spectrometer, which is designed for real-time, direct gas introduction and analysis.
June 19, 2017Hitachi High-Technologies Corp., Japan, introduces the new Regulus series of field emission scanning electron microscopes that offer enhanced functionality with improved resolution and operability.
June 18, 2017Imec, Belgium, and Cascade Microtech, Germany, announce the successful development of a fully automatic system for pre-bond testing of advanced 3D chips.