Industry News


Keep up-to-date on the latest advances in the metals and materials industry with ASM Industry News.

Materion acquires Heraeus target materials for its semiconductor and other markets

March 20, 2017

Materion Corp., Mayfield Heights, Ohio, announces that it has acquired the target materials business of the Heraeus Group to strengthen its position in precious and non-precious target materials for the semiconductor, architectural and automotive glass, photovoltaic, and display markets.

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JEOL module enables mass spectrometer materials analysis by ambient ionization

March 20, 2017

JEOL, Peabody, Mass., announces that a new FilterSpray module developed for the AccuTOF-DART mass spectrometer makes it possible to spot a sample on a disposable paper triangle for analysis by ambient ionization.

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Hitachi launches transmission electron microscope with improved electro-optics.

March 20, 2017

Hitachi High-Technologies Corp., Tokyo, introduces the HT7800 Series Transmission Electron Microscope, which features digital operation under normal room light conditions (like the HT7700 model) and also incorporates improved electro-optics with many new functions.

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Cadence to collaborate with TSMC for design innovation with its 12FFC process

March 20, 2017

Cadence Design Systems Inc., San Jose, Calif., announces its collaboration with the Taiwan Semiconductor Manufacturing Co. (TSMC) to further advanced-node design innovation with TSMC's new 12nm FinFET Compact (12FFC) process technology.

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January 2017 semiconductor sales up 14 percent over January 2016

March 16, 2017

The Semiconductor Industry Association, Washington, announces that worldwide sales of semiconductors reached $30.6 billion for the month of January 2017, an increase of 13.9% compared to the January 2016 total of $26.9 billion.

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Swiss researchers develop X-ray tomography for 3-D imaging of 34-nm transistor on a chip

March 16, 2017

Researchers of the Paul Scherrer Institute in Switzerland have reportedly made detailed 3-D images of a commercially available computer chip, marking the first time a nondestructive method has visualized the paths of a chip's internal 45-nm-wide wiring and its 34-nm-high transistors clearly without distortions or deformations.

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Barcelona scientists bond chips to circuit boards with ink containing silver nanoparticles

March 16, 2017

A team of researchers at the University of Barcelona has reportedly demonstrated a new bonding technique for surface mounted devices in which an inkjet printer with ink that incorporates silver nanoparticles bonds the devices.

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Nikon PCB inspection system features intuitive navigation of electronic devices

March 16, 2017

Nikon Metrology, Brighton, Mich., introduces the XT V 160, a highly flexible and cost-effective electronics and semiconductor inspection system designed for production facilities and failure analysis laboratories.

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One Minute Mentor: Nitriding in Fluidized-Bed Reactors at Low Temperatures

March 16, 2017

In nitriding treatment furnaces, the heating is done electrically, and the fluidizing gas composition is chosen to provide the optimum chemistry for the desired surface treatment (usually a mixture of NH3 + N2, with CH4 added when nitrocarburizing is desired).

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Wisconsin Oven composite curing ovens feature temperature uniformity of ±5°F

March 15, 2017

Wisconsin Oven Corp., East Troy, Wis., has shipped three electrically heated, heavy-duty walk-in ovens with temperature uniformity of ±5°F for composite curing.

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