Keep up-to-date on the latest advances in the metals and materials industry with ASM Industry News.
March 22, 2017Argonne National Laboratory, Lemont, Ill., announces that a research team has developed a self-lubricating diamondlike carbon tribofilm that regenerates itself by breaking down the molecules of lubricating oil and rebuilding the tribofilm as it is worn away.
March 20, 2017Bruker, Billerica, Mass., introduces the SkyScan 1275, a high-speed X-ray microtomography benchtop system specially designed for fast scanning using new advances in the technology of X-ray sources and efficient flat-panel detectors.
March 20, 2017Materion Corp., Mayfield Heights, Ohio, announces that it has acquired the target materials business of the Heraeus Group to strengthen its position in precious and non-precious target materials for the semiconductor, architectural and automotive glass, photovoltaic, and display markets.
March 20, 2017JEOL, Peabody, Mass., announces that a new FilterSpray module developed for the AccuTOF-DART mass spectrometer makes it possible to spot a sample on a disposable paper triangle for analysis by ambient ionization.
March 20, 2017Hitachi High-Technologies Corp., Tokyo, introduces the HT7800 Series Transmission Electron Microscope, which features digital operation under normal room light conditions (like the HT7700 model) and also incorporates improved electro-optics with many new functions.
March 20, 2017Cadence Design Systems Inc., San Jose, Calif., announces its collaboration with the Taiwan Semiconductor Manufacturing Co. (TSMC) to further advanced-node design innovation with TSMC's new 12nm FinFET Compact (12FFC) process technology.
March 16, 2017The Semiconductor Industry Association, Washington, announces that worldwide sales of semiconductors reached $30.6 billion for the month of January 2017, an increase of 13.9% compared to the January 2016 total of $26.9 billion.
March 16, 2017Researchers of the Paul Scherrer Institute in Switzerland have reportedly made detailed 3-D images of a commercially available computer chip, marking the first time a nondestructive method has visualized the paths of a chip's internal 45-nm-wide wiring and its 34-nm-high transistors clearly without distortions or deformations.
March 16, 2017A team of researchers at the University of Barcelona has reportedly demonstrated a new bonding technique for surface mounted devices in which an inkjet printer with ink that incorporates silver nanoparticles bonds the devices.
March 16, 2017Nikon Metrology, Brighton, Mich., introduces the XT V 160, a highly flexible and cost-effective electronics and semiconductor inspection system designed for production facilities and failure analysis laboratories.