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April 24, 2017Gartner Inc., Stamford, Conn., reports that worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled $37.4 billion in 2016, an 11.3% increase from 2015.
April 24, 2017Yale University, New Haven, Conn., announces that a research team recently discovered that black phosphorus could possibly replace silicon as the primary material for electronics.
April 24, 2017Kulicke & Soffa Industries Inc., Singapore, has opened a new Process and Applications laboratory at the K&S Netherlands facility in Eindhoven.
April 24, 2017Global Foundries, Santa Clara, Calif., announces plans to expand its global manufacturing footprint in response to growing customer demand for its comprehensive and differentiated technology portfolio.
April 24, 2017Bruker, Billerica, Mass., announces new software and hardware products that address the need for enhanced workflow solutions for NMR spectroscopy research and analysis.
April 24, 2017SUSS MicroTec, Germany, has launched the XBS200 automated permanent wafer bonding system designed for aligned wafer bonding of wafer sizes up to 200 mm.
April 24, 2017Semiconductor Research Corp. (SRC), Durham, N.C., announces that Taiwan Semiconductor Manufacturing Company, Ltd., (TSMC) has signed an agreement to participate in two SRC research initiatives.
April 24, 2017Semiconductor Research Corporation (SRC), Durham, N.C., announces that Taiwan Semiconductor Manufacturing Company, Ltd., (TSMC) has signed an agreement to participate in two SRC research initiatives.
April 24, 2017Siemens AG, Munich, announces the recent closing of its acquisition of Mentor Graphics Corp., Wilsonville, Ore., which is now part of Siemens' product lifecycle management software business.
April 24, 2017The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $30.4 billion for the month of February 2017, an increase of 16.5% compared to the February 2016 total of $26.1 billion.