Keep up-to-date on the latest advances in the metals and materials industry with ASM Industry News.
March 22, 2017Instron, Norwood, Mass., reports that the newly released ISO 6892-1:2016 standard for ambient tensile testing of metallic materials provides greater clarity of the major changes that were introduced in the previous version, ISO 6892-1:2009.
March 22, 2017Arconic, New York, announces a multi-year supply deal with Toyota North America to supply aluminum for its all-new Lexus RX models, Toyota's first vehicle in North America to prominently feature aluminum exterior panels.
March 22, 2017Argonne National Laboratory, Lemont, Ill., announces that a research team has developed a self-lubricating diamondlike carbon tribofilm that regenerates itself by breaking down the molecules of lubricating oil and rebuilding the tribofilm as it is worn away.
March 20, 2017Bruker, Billerica, Mass., introduces the SkyScan 1275, a high-speed X-ray microtomography benchtop system specially designed for fast scanning using new advances in the technology of X-ray sources and efficient flat-panel detectors.
March 20, 2017Materion Corp., Mayfield Heights, Ohio, announces that it has acquired the target materials business of the Heraeus Group to strengthen its position in precious and non-precious target materials for the semiconductor, architectural and automotive glass, photovoltaic, and display markets.
March 20, 2017JEOL, Peabody, Mass., announces that a new FilterSpray module developed for the AccuTOF-DART mass spectrometer makes it possible to spot a sample on a disposable paper triangle for analysis by ambient ionization.
March 20, 2017Hitachi High-Technologies Corp., Tokyo, introduces the HT7800 Series Transmission Electron Microscope, which features digital operation under normal room light conditions (like the HT7700 model) and also incorporates improved electro-optics with many new functions.
March 20, 2017Cadence Design Systems Inc., San Jose, Calif., announces its collaboration with the Taiwan Semiconductor Manufacturing Co. (TSMC) to further advanced-node design innovation with TSMC's new 12nm FinFET Compact (12FFC) process technology.
March 16, 2017The Semiconductor Industry Association, Washington, announces that worldwide sales of semiconductors reached $30.6 billion for the month of January 2017, an increase of 13.9% compared to the January 2016 total of $26.9 billion.
March 16, 2017Researchers of the Paul Scherrer Institute in Switzerland have reportedly made detailed 3-D images of a commercially available computer chip, marking the first time a nondestructive method has visualized the paths of a chip's internal 45-nm-wide wiring and its 34-nm-high transistors clearly without distortions or deformations.