Industry News


Keep up-to-date on the latest advances in the metals and materials industry with ASM Industry News.

One Minute Mentor: Physical Metallurgy of Expanded Austenite

April 27, 2017

The microstructural feature responsible for the favorable technological properties resulting from low-temperature gaseous thermochemical treatment is a supersaturation of nitrogen and/or carbon in austenite. This is called expanded austenite.

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Harper and Ferrite partner to expand solutions for industrial microwave heating

April 26, 2017

Harper International, Buffalo, N.Y., announces that it is partnering with Ferrite Microwave Technologies, Nashua, N.H., to utilize FMT's high-power microwave heating technology to complement its product portfolio of traditional gas and electric fired furnaces.

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Global semiconductor wafer-level equipment revenue increased 11% in 2016

April 24, 2017

Gartner Inc., Stamford, Conn., reports that worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled $37.4 billion in 2016, an 11.3% increase from 2015.

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Black phosphorus could replace silicon in semiconductors to make smaller devices

April 24, 2017

Yale University, New Haven, Conn., announces that a research team recently discovered that black phosphorus could possibly replace silicon as the primary material for electronics.

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Kulicke & Soffa opens process and applications laboratory in The Netherlands

April 24, 2017

Kulicke & Soffa Industries Inc., Singapore, has opened a new Process and Applications laboratory at the K&S Netherlands facility in Eindhoven.

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Global Foundries to expand in the United States, Germany, China, Singapore

April 24, 2017

Global Foundries, Santa Clara, Calif., announces plans to expand its global manufacturing footprint in response to growing customer demand for its comprehensive and differentiated technology portfolio.

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Bruker introduces software and hardware NMR spectroscopy solutions

April 24, 2017

Bruker, Billerica, Mass., announces new software and hardware products that address the need for enhanced workflow solutions for NMR spectroscopy research and analysis.

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SUSS MicroTec launches automated permanent wafer bonding system

April 24, 2017

SUSS MicroTec, Germany, has launched the XBS200 automated permanent wafer bonding system designed for aligned wafer bonding of wafer sizes up to 200 mm.

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Taiwan Semiconductor to join SRC project to optimize materials and processes

April 24, 2017

Semiconductor Research Corp. (SRC), Durham, N.C., announces that Taiwan Semiconductor Manufacturing Company, Ltd., (TSMC) has signed an agreement to participate in two SRC research initiatives.

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Taiwan Semiconductor to join SRC project to optimize materials and processes

April 24, 2017

Semiconductor Research Corporation (SRC), Durham, N.C., announces that Taiwan Semiconductor Manufacturing Company, Ltd., (TSMC) has signed an agreement to participate in two SRC research initiatives.

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