Keep up-to-date on the latest advances in the metals and materials industry with ASM Industry News.
August 01, 2017Lindberg MPH, Riverside, Mich., has shipped an electrically heated rod over-bend atmosphere box furnace capable of providing six different atmospheres, to a company in the steel and mining industry.
August 01, 2017Wisconsin Oven Corp., East Troy, Wis., has shipped two natural-gas-fired enhanced-duty walk-in batch ovens that are designed to dry the sand cores used in the casting of a variety of parts.
August 01, 2017The Center for Heat Treating Excellence at the Worcester Polytechnic Institute, Mass., announces that it has presented its Distinguished Service Award to Steve Ferdon.
August 01, 2017Can-Eng Furnaces International Ltd., Niagara Falls, Ontario, has been awarded a contract to design and build a 1500 lb/hr mesh belt furnace system for the austenitizing and molten salt quenching of unique components for world-class drivetrain systems.
July 27, 2017Sandia National Laboratories, Albuquerque, N.M., has borrowed and refined X-ray phase contrast imaging, originally developed for medical X-rays, to look inside low-density materials without taking them apart.
July 27, 2017Japan's National Institute for Materials Science and Nagaoka University of Technology announce development of a high-strength magnesium sheet alloy that has excellent formability comparable to that of the aluminum sheet currently used in body panels of some automobiles.
July 27, 2017Ipsen, Cherry Valley, Ill., announces that it will offer a $50,000 credit toward the purchase of a new Titan vacuum furnace (applies to the 2017 list price of any Titan model) to any company that trades in its old furnace.
July 27, 2017MTS Systems Corp., Eden Prairie, Minn., has strengthened its position in India by establishing the MTS India headquarters in Bangalore.
July 25, 2017Stanford University, California, and the Massachusetts Institute of Technology, Cambridge, announce that researchers have developed a new semiconductor chip made of carbon nanotubes and resistive random-access memory (RRAM) cells.