Electronic Device Failure Analysis (EDFA)

Electronic Device Failure Analysis is a growing technical resource for the Failure Analysis engineer.  Each quarterly issue covers:

  • Contributed technical articles that cover everything from operations to techniques  

  • Insight into trends in the microelectronics FA industry, to keep you up-to-date

  • New product announcements

  • Recognition of outstanding contributions to the field of FA

  • Looking to update some skills?  The Training Calendar provides an easy way to know what courses are coming up in the months ahead.

  • News of the Electronic Device Failure Analysis Society.

  • Guest Columns provide that vital perspective into other FA

EDFA Author Guidelines (pdf)

EDFA Guest Editorial & Columnist Guidelines (pdf)

EDFA Sample Article (pdf)

EDFA Editorial Board

Felix Beaudoin, Editor and Chair, Global Foundries, Malta, NY, USA 
Mike Bruce, Immediate Past Chair, Independent Consultant, Austin, TX, USA
Rose Ring, Past Chair, Global Foundries, Wappingers Falls, NY, USA
James Demarest, Board Liaison, International Business Machine, Albany, NY, USA
Nicholas Antoniou, Revera, Inc., Santa Clara, CA, USA
David Burgess, Accelerated Analysis, Half Moon Bay, CA, USA
Jiann Min Chin, AMD Singapore, Singapore
Ed Cole, Sandia National Laboratories, Albuquerque, NM, USA
Szu Huat Goh, Golbal Foundries, Singapore
Ted Kolasa, Orbital ATK, Scottsdale, AZ, USA
Andreas Meyer, Global Foundries, Germany
Philippe Perdu, CNES, Toulouse, France
Paiboon Tangyunyong, Sandia National Labs, Albuquerque, NM, USA
David P. Vallett, PeakSource Analytical, LLC, Fairfax, VT, USA 
E. Jan Vardaman, TechSearch International, Inc., Austin, TX
Martin Versen, University of Applied Sciences Rosenheim, Germany
Larry Wagner, LWSN Consulting, Plano, TX, USA
Liz Marquard, Managing Editor, ASM International, Materials Park, OH, USA
Kelly Sukol, Production Supervisor, ASM Internnational, Materials Park, OH USA
Ann Britton, ASM Staff Liaison, Materials Park, OH, USA
Mary Anne Fleming, ASM Staff Associate, Materials Park, OH, USA