Failure Analysis and Reliability of Optoelectronic Devices

Author: Robert W. Herrick, JDSU   |   Document Download   |   Product code: ZMEFA2011P078

File size: 2 MB

Classified as: Electronics Soldering

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It is commonly said that optoelectronics fabrication today resembles integrated circuit manufacture 20-30 years ago. The explanation for such a lag centers on the smaller volume of production of optoelectronic devices and the relative immaturity of the technology. Failure analysis (FA) techniques are if anything perhaps further behind the need than was the case for silicon integrated circuits decades ago. An optoelectronics vendor who sells $50 million of optoelectronic parts in a year might be a leader in their market segment. Compare this with Intel, which sold over $35 billion in 2009.
  • From: Microelectronics Failure Analysis, Desk Reference Sixth Edition
  • Published: October 01, 2011
  • Pages: 78 - 98 (21)
  • Review Type: Peer reviewed