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    ISTFA 2016: Proceedings from the 42nd International Symposium for Testing and Failure Analysis (November 6–10, 2016, Fort Worth, Texas, USA)

    Published: 2016

    This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community.

    Material Resources / Publications

    MS&T 2016: Proceedings from the Materials Science and Technology 2016 Conference, Salt Lake City, UT, October 23-27, 2016

    Published: 2016

    The leading forum addressing structure, properties, processing and performance across the materials community.

    Material Resources / Publications

    ISTFA 2016 Proceedings from the 42nd International Symposium for Testing and Failure Analysis

    Published: 2016

    This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, The Next Generation FA Engineer.

    Material Resources / Publications

    Advances in Materials Technology for Fossil Power Plants, Proceedings from the Eighth International Conference (EPRI 2016)

    Published: 2016

    Conference proceedings covering the latest technology developments for fossil fuel power plants, including materials processing of advanced alloys; high-temperature materials used in boilers and turbines in steam power plants; corrosion, coatings, claddings; welding and fabrication; creep, fatigue, creep-fatigue, toughness, and high-temperature design rules.

    Material Resources / Publications

    IFHTSE 2016: Proceedings of the 23rd IFHTSE Congress (April 18-21, 2016, Savannah, Georgia, USA)

    Published: 2016

    The ASM Heat Treating Society and the International Federation of Heat Treatment and Surface Engineering have partnered to create an exciting event focused on Thermal Processing, Heat Treating and Surface Engineering. This event will bring together international experts from around the globe to present the latest innovations and research in Thermal Processing and Surface Engineering.

    Material Resources / Publications

    ISTFA 2015 Proceedings from the 41st International Symposium for Testing and Failure Analysis

    Published: 2015

    This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Follow the Data!

    Material Resources / Publications

    ISTFA 2015 Proceedings from the 41st International Symposium for Testing and Failure Analysis

    Published: 2015

    This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Follow the Data!

    Material Resources / Publications

    ISTFA 2015 Tutorial Presentations from the 41st International Symposium for Testing and Failure Analysis

    Published: 2015

    ISTFA 2015: Tutorial Presentations from the 41st International Symposium for Testing and Failure Analysis

    Material Resources / Publications

    Advanced Failure Analysis of Junction Profile Defect by Using EBAC/EBIC

    Published: 2015
    Authors: Jong Hak Lee, Jae Yoon Lee, Dae Woo Kim, Kyoung Wook Jung, Soo Yong Son, SK Hynix Semiconductor

    As semiconductor device geometries shrink due to process technology development and circuit density rapidly increases, it is becoming extremely difficult to effectively analyze defects.

    Material Resources / Publications

    Non-Visible Defect Analysis by the Nanoprobing Methodology

    Published: 2015
    Authors: C.Q. Chen, G.B. Ang, P.T. Ng, A.C.T. Quah, H.P. NG, Angela, J. Lam, Z.H. Mai, GlobalFoundries Singapore Pte. Ltd.

    As semiconductor technology keeps scaling down, failure analysis and device characterization become more and more challenging.

    Material Resources / Publications