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    Medical Device Design Validation and Failure Analysis, October 26-27, 2017

    October 26, 2017 - October 27, 2017
    Santa Clara, CA, 92610, USA
    Instructor: Dr. William Kane

    This course provides you with a fundamental understanding of the design process necessary to make robust medical devices. Fracture, fatigue, stress analysis, and corrosion design validation approaches are examined, and real-world medical device design validations are reviewed. Further, since failures often provide us with important information about any design, mechanical and materials failure analysis techniques are covered. Several medical device failure analysis case studies are provided.

    Learning & Professional Development / Courses / Classroom

    Software enables SEM analysis of multi-layer structures without cross-sectioning

    August 12, 2017

    Bruker Nano Analytics, Oak Park, Ill., introduces XMethod, the world's first software package for the analysis of composition and thickness of single or multiple layers, based on data obtained by sample excitation with the XTrace micro-focus X-ray source for scanning electron microscopes.

    News, Magazine & Media / Industry News

    Imaging instrument for electronics combines thermal camera, temperature measurement

    August 11, 2017

    Flir Systems, Wilsonville, Ore., introduces the ETS320, a thermal imaging and temperature measurement instrument for electronic components and printed circuit boards.

    News, Magazine & Media / Industry News

    Sandia X-ray phase contrast imaging sees foams and epoxies within layers of metal

    July 27, 2017

    Sandia National Laboratories, Albuquerque, N.M., has borrowed and refined X-ray phase contrast imaging, originally developed for medical X-rays, to look inside low-density materials without taking them apart.

    News, Magazine & Media / Industry News

    ASM Board of Trustees

    Board of Trustees Meet the committed men and women who represent the best interests of the membership and lead our society. The ASM Board of Trustees is comprised of four officers...

    Governance / About / About / Board of Trustees

    Bruker X-ray diffraction imaging systems offer in-line monitoring of wafer crystalline defects

    July 25, 2017

    Bruker Semiconductor Division, Billerica, Mass., announces that leading multiple semiconductor manufacturers have ordered JVSensus-600E X-ray diffraction imaging systems for in-line wafer monitoring of crystalline defects.

    News, Magazine & Media / Industry News

    Oxford Instruments Industrial Analysis business joins Hitachi to form new company

    July 12, 2017

    Oxford Instruments, England, announces that its Industrial Analysis business will join Japan's Hitachi High-Technologies to form a new company, Hitachi High-Tech Analytical Science.

    News, Magazine & Media / Industry News

    Leica DM3 XL microscope system inspects wafers fast with 30% larger field of view

    June 19, 2017

    Leica Microsystems Inc., Buffalo Grove, Ill., has developed the DM3 XL microscope inspection system for process control or defect and failure analysis in the microelectronics and semiconductor industry.

    News, Magazine & Media / Industry News

    How and When Metals Fail

    Published: May 30, 2017
    Running time: 2:57

    Of paramount importance in both the design and upkeep of materials is a predictive capability for their failure. An improved understanding of ductile failure will offer increases in efficiency, reliability, and applicability of metals and their...

    News, Magazines & Features / Videos

    Two-sensor-tool imaging technology detects dead open faults with high accuracy

    May 21, 2017

    Neocera, Beltsville, Md., has developed the Magma electronic fault isolation HiRes microscope system that combines two sensors into one tool: a SQUID sensor for detecting the smallest possible currents, and a magnetoresistive sensor for best spatial resolution when scanning close to the current.

    News, Magazine & Media / Industry News