October 26, 2017 - October 27, 2017
Santa Clara, CA, 92610, USA
Instructor: Dr. William Kane
This course provides you with a fundamental understanding of the design process necessary to make robust medical devices. Fracture, fatigue, stress analysis, and corrosion design validation approaches are examined, and real-world medical device design validations are reviewed. Further, since failures often provide us with important information about any design, mechanical and materials failure analysis techniques are covered. Several medical device failure analysis case studies are provided.
August 12, 2017Bruker Nano Analytics, Oak Park, Ill., introduces XMethod, the world's first software package for the analysis of composition and thickness of single or multiple layers, based on data obtained by sample excitation with the XTrace micro-focus X-ray source for scanning electron microscopes.
August 11, 2017Flir Systems, Wilsonville, Ore., introduces the ETS320, a thermal imaging and temperature measurement instrument for electronic components and printed circuit boards.
July 27, 2017Sandia National Laboratories, Albuquerque, N.M., has borrowed and refined X-ray phase contrast imaging, originally developed for medical X-rays, to look inside low-density materials without taking them apart.
July 25, 2017Bruker Semiconductor Division, Billerica, Mass., announces that leading multiple semiconductor manufacturers have ordered JVSensus-600E X-ray diffraction imaging systems for in-line wafer monitoring of crystalline defects.
July 12, 2017Oxford Instruments, England, announces that its Industrial Analysis business will join Japan's Hitachi High-Technologies to form a new company, Hitachi High-Tech Analytical Science.
June 19, 2017Leica Microsystems Inc., Buffalo Grove, Ill., has developed the DM3 XL microscope inspection system for process control or defect and failure analysis in the microelectronics and semiconductor industry.
Published: May 30, 2017
Running time: 2:57
Of paramount importance in both the design and upkeep of materials is a predictive capability for their failure. An improved understanding of ductile failure will offer increases in efficiency, reliability, and applicability of metals and their...
May 21, 2017Neocera, Beltsville, Md., has developed the Magma electronic fault isolation HiRes microscope system that combines two sensors into one tool: a SQUID sensor for detecting the smallest possible currents, and a magnetoresistive sensor for best spatial resolution when scanning close to the current.