ISTFA 2017

  • November 5-9, 2017
  • Pasadena Convention Center
  • Pasadena, CA, USA

ISTFA's 2017 General Info

Plan today to attend ISTFA 2017!  This year's theme is ‘Striving for 100% Success Rate'

We are currently accepting papers for the technical program of the 43rd International Symposium for Testing and Failure Analysis (ISTFA). Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.

Deadline for Abstract Submission:  April 21, 2017

Submit Your Abstract Today!

2016 Highlights

Keynote Presentation 
How to Educate the Next Generation IC Debug / FA Engineer at Academia



Panel Discussion
Next Generation of FA Engineers



Best Paper
VLP… Demonstrating 110 nm Resolution in Common Laser Probing Applications
Dr. Travis Eiles, Intel Corporation

Outstanding Paper
Root Cause Analysis for Pin Leakage

Best Poster
Validation of DLS data by LVP in case of marginal failure
Keonil Kim, Samsung Electronics S.SLI division

Outstanding Poster
Sample Preparation Challenges in removing Copper Pillar WLCSP Device Embedded in PCB Module for Electrical Testing and Failure Analysis
Kah Chin Cheong, ON Semiconductor

Best Student Poster
Solder Ball Reliability Assessment of WLCSP Through Power Cycling
Bhavna Conjeevaram, University of Texas Arlington

Best Video
ACETONEMENT aka: Where did the Bond Wires Go?
Timothy Hazeldine, ULTRA TEC