- November 5-9, 2017
- Pasadena Convention Center
- Pasadena, CA, USA
ISTFA's 2017 General Info
Plan today to attend ISTFA 2017! This year's theme is ‘Striving for 100% Success Rate'
We are currently accepting papers for the technical program of the 43rd International Symposium for Testing and Failure Analysis (ISTFA). Paper selection is based entirely on information submitted in abstracts and will be evaluated on novelty, completeness, quality, and benefit to the FA community. Submit your minimum two-page abstract including images, figures, and references.
Deadline for Abstract Submission: April 21, 2017
How to Educate the Next Generation IC Debug / FA Engineer at Academia
Next Generation of FA Engineers
VLP… Demonstrating 110 nm Resolution in Common Laser Probing Applications
Dr. Travis Eiles, Intel Corporation
Root Cause Analysis for Pin Leakage
Dr. Zhigang Song, GLOBALFOUNDRIES
Validation of DLS data by LVP in case of marginal failure
Keonil Kim, Samsung Electronics S.SLI division
Sample Preparation Challenges in removing Copper Pillar WLCSP Device Embedded in PCB Module for Electrical Testing and Failure Analysis
Kah Chin Cheong, ON Semiconductor
Best Student Poster
Solder Ball Reliability Assessment of WLCSP Through Power Cycling
Bhavna Conjeevaram, University of Texas Arlington
ACETONEMENT aka: Where did the Bond Wires Go?
Timothy Hazeldine, ULTRA TEC