Buehler, a division of ITW Inc., Lake Bluff, Ill., introduces the PlanarMet 300 benchtop planar grinding machine. It utilizes a fixed abrasive stone for rapid sample grinding, and accommodates specimen holders up to 7 in. diameter. Directly integrated with the EcoMet/AutoMet Grinder-Polisher, this stone grinder features a high-torque, continuous-duty, 5.7 Hp motor with auto wheel dressing, compact interlocking safety cover, and built-in cooling.
The 5.7 Hp motor allows aggressive material removal, and is up to four times faster than grinding with SiC paper: One grinding stone is equivalent to 1000 sheets of SiC paper. Aluminum or SiC grinding stones can be used for almost any material application. The auto dressing system ensures fresh, consistent, abrasive surfaces.
The PlanarMet’s programmable grinding depth is accurate to 0.01 mm. It has two operational modes: timed cycle, and controlled material depth removal (Z-axis). High water flow and a unique manifold keep specimens cool, minimizing subsurface damage. No compressed air or water hook-up is needed.
The benchtop design saves space and allows for direct integration to grinder-polishers for polishing steps, yet is just as powerful as large floor models. The durable cast cover provides maximum user safety with magnetic interlock.
http://www.buehler.com/PlanarMet-300.php
