The Institute for Matter and Systems at Georgia Tech, in collaboration with the Georgia Tech Research Institute, has launched the Georgia Tech Quantum Applications Research Center to accelerate the development of quantum technologies across materials, devices, and systems.
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3D-Micromac AG, Germany, highlighted its microPREP L laser-based sample preparation system for advanced semiconductor packaging failure analysis and quality assurance, enabling targeted defect access across samples ranging from individual dies to full 300-mm wafers and system-level boards.
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Synopsys, Sunnyvale, Calif., and OpenAI, San Francisco, Calif., have partnered to bring together OpenAI’s advanced AI capabilities with Synopsys’ industry-leading electronic design automation tools and agentic AI capabilities to revolutionize the design of semiconductors.
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Hamamatsu Photonics, Japan, developed the iPHEMOS-DDX, an inverted emission microscope designed for failure analysis of advanced semiconductor packages, including AI chiplets, high bandwidth memory, 2.5D/3D packages, and large-scale semiconductor packages.
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Smith+Nephew, Watford, United Kingdom, announced an exclusive US distribution agreement with RMR Ortho to add the A’TOMIC Nitinol Fixation System to its Trauma, Foot & Ankle, and Hand & Wrist portfolio.
The A’TOMIC system leverages proprietary manufacturing methods and the unique properties of nitinol to provide compressive fixation implants featuring a wide bridge with barbed, round legs that match drill holes. The system is engineered to achieve stability of fusion, fracture, and osteotomy sites through high strength and active compression, designed to improve implant integrity and patient comfort.
“This partnership strengthens Smith+Nephew’s fixation portfolio by adding a dynamic compression fixation solution that complements our existing technologies,” said Scott Gunn, Vice President of U.S. Marketing, Trauma, Extremities, and Shoulder at Smith+Nephew. The agreement expands the company’s ability to participate in high-frequency fracture and arthrodesis procedures while leveraging established Extremities and Trauma sales channels.
“Partnering with Smith+Nephew represents an important step forward as we continue to expand access to the A’TOMIC Nitinol Fixation System across key U.S. territories,” said Joe Ritz, CEO of RMR Ortho.
Smith+Nephew is a global medical technology company operating in more than 100 countries with approximately 18,000 employees.
[www.smith-nephew.com](https://www.smith-nephew.com)
Applied Materials, Inc., Santa Clara, Calif., introduced a new defect review system to help semiconductor manufacturers continue pushing the limits of chip scaling combining the industry’s most sensitive electron beam technology with advanced AI image recognition to enable better and faster analysis of buried nanoscale defects.
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Optotherm, Inc., Warrandale, Pa., a designer and manufacturer of infrared imaging components and systems, released the MW640-15, a high-sensitivity MWIR thermal imaging camera designed for front and backside IC failure analysis, lock-in thermography, and microscopic temperature measurement.
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Sigray, Inc. of Benicia, Calif. has launched the Apex-Hybrid, a breakthrough X-ray system designed to revolutionize failure analysis in semiconductor and electronics labs with interchangeable laminography and tomography modes, delivering exceptional speed and 350nm high-resolution imaging for everything from large packages and PCBs to the smallest components.
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Ironwood Electronics, Eagan, Minn., is now producing elastomer sockets which include a protective “P” layer that allows for more insertions by protecting the elastomer from erosion and debris build up, extending the life of the elastomers to 200,000 plus insertions.
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Researchers at the University of Vermont developed microchips with a feature that combines anti-counterfeit with a function that causes them to self-destruct if an attempt is made to compromise them.
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Researchers at the Technion – Israel Institute of Technology, Israel, have shown how to exploit the natural nonlinearity of silicon to track the propagation of light through a circuit to characterize a chip’s performance.
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Bruker Corp., Santa Barbara, Calif., has released the NanoMechanics Lab, a suite of force-mapping modes that enable Dimension FastScan and Icon AFM systems for quantitative nanoscale characterization, extending from soft hydrogels and polymers to hard metals and ceramics.
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