Researchers at the University of Southern California have unveiled a new memristor memory device that continues to operate at 700 degrees Celsius (~1300 degrees Fahrenheit), marking it as the most robust high-temperature memory technology ever demonstrated.
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Researchers at the Fraunhofer Institute for Integrated Circuits IIS, Germany, are developing an open-source tool to enhance the prevention of radiation-induced functional degradation in electronic systems.
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The Department of Energy has announced funding $179 million for three Microelectronics Science Research Centers that bring together multi-institutional, multidisciplinary projects in partnership with industry organized around making microelectronics more energy efficient and able to operate better in extreme environments.
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Researchers at Iowa State University, Ames, Iowa, have successfully demonstrated a groundbreaking zero-gravity 3D printing technology using electrohydrodynamic printing and nanoink, paving the way for on-demand manufacturing and electronics repair in space.
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Innovative Space Carrier Inc., Japan, has partnered with WAAM3D, UK; Cranfield University, UK; and Aichi Sangyo Co Ltd., Japan, leveraging Wire Arc Additive Manufacturing technology to accelerate the development of propellant tanks for space transportation systems.
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Researchers from Stanford University, Palo Alto, Calif., sent an investigation to the space station to leverage microgravity to improve the synthesis of materials for photovoltaic devices designed to convert sunlight into electricity for solar energy applications.
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