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Featured Paper from Heat Treat 2017

Today’s competitive environment often requires one to do more with less – to make equipment last longer and run more efficiently.

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ASB Industries adds a new Plasma Electric Arc system to its thermal spray equipment

ASB Industries, Barberton, Ohio, announces that it recently purchased a new Plasma Electric Arc system to increase spray capacity, turning another thermal spray production room into a multi-process-capable area.

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Spirit Aerosystems and Norsk Titanium to produce 3D-printed titanium components

Spirit AeroSystems, Wichita, Kan., and Norsk Titanium AS, Sweden, have entered into a commercial agreement to produce 3D-printed structural titanium components for the commercial aerospace industry via Norsk Titanium’s proprietary plasma-arc Rapid Plasma Deposition technology.

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Nitrex awarded contract for turnkey nitriding system by European auto components supplier

Nitrex Metal Inc., St. Laurent, Quebec, announces that a European automotive components supplier has awarded it a contract for the supply of a turnkey nitriding system with potential-controlled Nitreg technology.

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Ipsen Atlas integral quench batch furnace helps ThermTech meet growing demand

Ipsen, Cherry Valley, Ill., reports that heat treating firm ThermTech recently purchased another Atlas integral quench batch furnace for carburizing, carbonitriding, and neutral hardening while supporting business from the oil and gas and heavy equipment industries.

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Bodycote awarded GM supplier quality excellence award for carburizing and nitriding

Bodycote, England, announces that its plant in Silao, Mexico, has been awarded the General Motors Supplier Quality Excellence Award for 2016.

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Cliffs Natural Resources to invest $700 million in Toledo hot briquetted iron plant

Cliffs Natural Resources Inc., Cleveland, Ohio, announces that it will invest $700 million for the development of its first hot briquetted iron (HBI) production plant, to be located at a site in Toledo, Ohio.

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Oerlikon, GE Additive collaborate to accelerate additive manufacturing industrialization

Oerlikon, Switzerland, has signed a Memorandum of Understanding with GE Additive, Pittsburgh, to collaborate on accelerating the industrialization of additive manufacturing.

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Nano-fabricated metamaterial optical filter protects aircraft pilots from laser beams

Airbus subsidiary Satair Group, Atlanta, and Metamaterial Technologies Inc. and its optical filters division Lamda Guard of Halifax, Nova Scotia, have signed a Memorandum of Understanding that will lead to an exclusive multi-million dollar global distribution agreement to bring MTI’s laser protection product MetaAir to the civil aviation market.

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Optomec awarded NASA contract for 3D printing of electronics by ALSS

Optomec, Albuquerque, N.M., announces that the company has been awarded a NASA SBIR contract for the further development of an adaptive laser sintering system (ALSS) for electronics.

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NanoSteel launches 3D-printable tool steel for laser powder bed fusion

Nanosteel, Providence, R.I., announces the launch of its first product for the laser powder bed fusion additive manufacturing process.

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Danieli to build JSW Steel “Plate Mill of the Future” in Texas for higher quality and precision

JSW Steel (USA) Baytown, Texas, has received preliminary Board approval, contingent upon securing governmental financial support, to proceed with a full-scale modernization project expected to take approximately 20 months to complete.

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Automatic surface area analyzer designed for multiple metal and ceramic powders

Quantachrome Instruments, Boynton Beach, Fla., introduces the AutoFlow BET+, an automatic surface area analyzer designed for high-speed, high-throughput analyses of metal and ceramic powders and porous materials.

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One Minute Mentor: Depth Profiles of Nitrided Stainless Steel AISI 316

The graph shows composition-depth profiles of nitrided stainless steel AISI 316 as determined with glow discharge optical emission spectrometry (GDOES).

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ArcelorMittal Long Products Canada completes $20 million finishing line at Quebec bar mill

ArcelorMittal Long Products Canada, Longueuil, Quebec, has inaugurated a new$20 million finishing line at its bar mill, to increase the facility’s annual rolling capacity from 400,000 to 500,000 metric tons.

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Lindberg box furnace built for batch testing aluminum automotive castings

Lindberg/MPH, Riverside, Mich., has shipped a large-chamber utility box furnace to an automotive supplier for batch testing aluminum castings on a daily basis at a temperature of 932°F.

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Spirit invests $30 million in five-axis machining center for aluminum and titanium aircraft parts

Spirit AeroSystems, Wichita, Kan., announces a new center of excellence focusing on the fabrication of complex aluminum and titanium commercial and military aircraft parts by new five-axis machines.

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Leica DM3 XL microscope system inspects wafers fast with 30% larger field of view

Leica Microsystems Inc., Buffalo Grove, Ill., has developed the DM3 XL microscope inspection system for process control or defect and failure analysis in the microelectronics and semiconductor industry.

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Brewer Science sells its semiconductor processing equipment business unit

Brewer Science, Rolla, Mo., announces that its Cee semiconductor processing equipment business unit has been sold to former Brewer Science employee Russ Pagel, who has formed a new company, Cost Effective Equipment LLC, to take over ownership and operate the business.

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Bruker launches next-gen WDXRF spectrometer for advanced quantitative analysis

Bruker Corp., Germany, launches its S8 Tiger Series 2, the next-generation wavelength dispersive X-ray fluorescence spectrometer, said to be the most versatile WDXRF tool available for advanced quantitative elemental analysis.

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Compact mass spectrometer designed for analysis of semiconductor process gases

JEOL USA, Peabody, Mass., introduces its new compact InfiTOF mass spectrometer, which is designed for real-time, direct gas introduction and analysis.

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Hitachi’s Regulus field emission SEMs feature resolution down to 0.9 nanometer

Hitachi High-Technologies Corp., Japan, introduces the new Regulus series of field emission scanning electron microscopes that offer enhanced functionality with improved resolution and operability.

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Imec and Cascade Microtech develop pre-bond testing system for advanced 3D chips

Imec, Belgium, and Cascade Microtech, Germany, announce the successful development of a fully automatic system for pre-bond testing of advanced 3D chips.

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Amkor Technology completes acquisition of Nanium for its semiconductor packaging

Amkor Technology Inc., Tempe, Ariz., has completed the acquisition of Nanium S.A., Portugal, a provider of wafer-level fan-out semiconductor packaging solutions.

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Optical silicone binder extends thermal stability to >180°C for chip-scale LED packaging

Dow Corning, Midland, Mich., introduces Dow Corning CL-1000 optical silicone binder, a new, more thermally stable, high-refractive-index material that is formulated to expand design options for high-power chip-scale LED packaging (CSP).

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IBM technology for building transistors from silicon nanosheets will enable 5nm chips

IBM, Armonk, N.Y., announces the development of the first industry process for building silicon nanosheet transistors that will enable 5nm chips.

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Global semiconductor sales increase by 21% year-to-year in April

The Semiconductor Industry Association, Washington, D.C., reports that worldwide sales of semiconductors reached $31.3 billion for the month of April 2017, an increase of 20.9 percent from the April 2016 total of $25.9 billion, and 1.3 percent more than the March total of $30.9 billion.

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Advanced high-strength steel ore unloading system wins 2017 Swedish Steel Prize

SSAB, Stockholm, announces that the 2017 winner of the Swedish Steel Prize is Kiruna Wagon of Sweden for its Helix Dumper, a highly durable and far more efficient ore-unloading wagon than other ore wagons on the market.

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Eck Industries licenses cerium-aluminum alloy that resists corrosion and high heat

Oak Ridge National Laboratory, Tenn., announces that Eck Industries, Manitowoc, Wis., has signed an exclusive license for the commercialization of a cerium-aluminum (Ce-Al) alloy that is easy to work with, lightweight, corrosion-resistant, and exceptionally stable at high temperatures.

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Superelasticity measured on nanometer pillars of Cu-Ni-Al shape-memory alloy

UPV/EHU-University of the Basque Country, Spain, announces that its researchers have explored superelasticity properties on a nanometer scale based on shearing a Cu-14Al-4Ni shape-memory alloy’s pillars down to nanometric size.

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