HP Inc., Palo Alto, Calif., drives additive manufacturing adoption through portfolio expansion, new material innovations, and global collaborations—including its partnership with GKN Powder Metallurgy, Cincinnati, Ohio, to expand copper applications using HP Metal Jet technology for cloud computing, electrification, and thermal management.
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Researchers at the University of New South Wales, Australia, have created a protective barrier on the front silver grid of a TOPCon solar cell using a 1 µm copper plating layer, which reduces corrosion susceptibility and significantly lowers contaminant-induced degradation compared to unprotected reference devices.
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Kyocera Corporation, Japan, launched a new Peltier (thermoelectric) module that boasts a maximum heat absorption rate 21% higher than its conventional products, significantly enhancing cooling performance for applications such as automotive battery and seat temperature control.
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Applied Materials, Inc., Santa Clara, Calif., introduced materials engineering innovations designed to increase the performance-per-watt of computer systems by enabling copper wiring to scale to the 2nm logic node and beyond.
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Hardide Coatings, United Kingdom, has launched the first in a new range of ready coated and enhanced components with a JP-5000 4” copper nozzle used in High-Velocity Oxy Fuel thermal spray coating.
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Integrated Global Services’ (IGS), headquartered in Richmond, VA, has improved a copper flash smelting furnace’s performance and lifetime through its high velocity thermal spray technology.
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A new study conducted by researchers from the University of Delaware’s Center for Composite Materials (CCM) and DuPont Specialty Products, Wilmington, Del., now provides insights about a composite material that can be used to make thin, flexible and durable circuit boards.
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Researchers at the Department of Energy’s Pacific Northwest National Laboratory, Richland, Wash., found that adding a small amount of solid carbon to copper boosts its ability to conduct electricity—industry applications abound.
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Imec, Belgium, a world-leading research and innovation hub in nanoelectronics and digital technologies, provided the first experimental evidence that the resistivity of a thin conductor film on a 300mm Si wafer can be lower than that of Cu and Ru, which are currently used in interconnect metallization schemes, marking a milestone towards enabling low-resistive interconnect with line widths below 10nm.
Continue readingOak Ridge National Laboratory (ORNL) researchers used neutron diffraction to identify a mechanism in a 3D-printed alloy—coined “load shuffling”—that could enable the design of better-performing lightweight materials for vehicles.
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