Cornell researchers, Ithaca, N.Y., have used high-resolution 3D imaging to detect, for the first time, the atomic-scale defects in computer chips that can sabotage their performance using a new imaging technique called electron ptychography.
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Intertek, UK, a leading Total Quality Assurance provider to industries worldwide, announced the opening of a new Intertek Caleb Brett laboratory in Naples, Italy, strengthening its presence in this important region and addressing a growing demand for reliable, high-quality testing services in crude oil, refined fuels, and emerging biofuels.
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Tescan, Czech Republic, announces that Carlyle, together with the other shareholders, has entered into a definitive agreement with Shimadzu Corporation, Japan, for the sale of the company, resulting in a change in Tescan’s shareholding structure.
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3D-Micromac AG, Germany, introduced microPREP L, a laser-based sample prep system that supports up to whole 12-inch wafers and system-level boards, enabling fast, precise, reproducible, and non-destructive material removal for semiconductor failure analysis and quality assurance.
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Oxford Instruments’ Raman imaging team in England announced a refreshed core microscope line and a groundbreaking new spectrometer, Hexalight, which together with the witec360 microscope constitute the most advanced confocal Raman imaging system yet devised.
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Exosens, France, extends its technology portfolio by signing an agreement to acquire Phasics, France, leader in high performance cameras based solutions for optical metrology.
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Gatan, Inc., Pleasanton, Calif., launched the EDAX Orbis II System, designed to support a wide range of non-destructive elemental analysis that use micro x-ray fluorescence.
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Instron, Norwood, Mass., released the AVE3, an advanced non-contacting video extensometer that delivers precise strain measurement with unparalleled, micron-level accuracy for tensile, compression, and bend testing.
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Sigray, Inc. of Benicia, Calif. has launched the Apex-Hybrid, a breakthrough X-ray system designed to revolutionize failure analysis in semiconductor and electronics labs with interchangeable laminography and tomography modes, delivering exceptional speed and 350nm high-resolution imaging for everything from large packages and PCBs to the smallest components.
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Keysight Technologies, Inc., Santa Rosa, Calif., has enhanced its double-pulse test portfolio enabling customers to benefit from accurate and easy measurement of the dynamic characteristics of wide-bandgap power semiconductor bare chips.
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Phase3D, Chicago, Ill., is working with commercial part manufacturer, Alloyed in the UK, to characterize part and build quality and determine how anomalies in a build cause defects in a part using the Fringe in-situ inspection system.
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The UK Battery Industrialization Center, United Kingdom, opened its new upgraded and extended Battery Development Laboratory, greatly increased the facility’s capabilities in key areas of battery materials characterization, cell analysis, and forensic activities.
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HORIBA STEC, Co., Ltd., Japan, released the fully automated thin film inspection system, Xtrology, that combines spectroscopic ellipsometry, Raman spectroscopy, and photoluminescence sensors making it possible to perform important inspections, such as film thickness measurement, defect analysis, and composition analysis of various wafers with a single instrument.
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QuantumDiamonds GmbH, Germany, a pioneer in quantum sensing technology, released the QD m.0, the first commercial quantum device designed specifically for semiconductor chip failure analysis, using diamond-based quantum microscopy to detect and localize faults in integrated circuits with high precision.
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Oxford Instruments plc, United Kingdom, a leading provider of high technology products and services to industry and scientific research communities, completed the acquisition of FemtoTools AG, Switzerland. The acquisition was first announced on 11 June 2024, and has been completed following the satisfactory conclusion of closing conditions.
FemtoTools specializes in measuring and imaging the properties (primarily the hardness and stiffness) of materials for research and semiconductor applications at very high resolution via a technique called nanoindentation. It joins Oxford Instruments’ Imaging & Analysis division, where its products will be sold in conjunction with the Group’s existing range of materials analysis tools, including electron microscope micro-analyzers and Raman microscopes.
Richard Tyson, chief executive officer, Oxford Instruments plc, said: “We are delighted to have completed the acquisition of FemtoTools. We welcome our new colleagues and look forward to working with them to integrate nanoindentation – a new technique to Oxford Instruments – into our extensive portfolio of materials analysis capabilities.”
Christian Lang, managing director, Materials Analysis, Oxford Instruments plc, said: “We’re so pleased that the FemtoTools team have chosen to join Oxford Instruments. We’ve had a number of very positive meetings since the announcement and are already making plans for our future together.
“I’m looking forward to integrating FemtoTools’ brilliant technology into our wider product range, and to working with this talented group of people.”
Felix Beyeler, co-founder of FemtoTools, said: “The team and I are very excited for the journey ahead as part of Oxford Instruments. Working together will enable us to extend the reach of our technology and provide even richer analysis to our combined customer base. We’re also looking forward to learning from the hugely experienced Oxford Instruments team.”
For more information:
Oxford Instruments plc
https://www.oxinst.com
Hexagon’s Manufacturing Intelligence division, Sweden, launched the first optical 3D scanner on the market with a motorized zoom lens that enables users to adjust data resolution and measurement volume entirely through software settings.
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Sigray, Concord, Calif., released the first commercial x-ray assisted device alteration tool that enables circuit debugging of emerging backside power delivery architectures.
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Researchers at Vienna University of Technology, Austria, developed an atomic force microscope sensor element of with a customized electronic circuit built directly into the tip whose signal directly provides information about the state of the tip, producing a more compact, simpler to process, cheaper technology with precision just as good as with previous devices.
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A team of researchers from the Ultramicroscopy Research Group at Trinity College at the University of Dublin, Ireland, completed the installation of a world-first User Adjustable Pole-piece (UAP) transmission electron microscope lens.
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Thermo Fisher Scientific, Hillsboro, Ore., the world leader in serving science, introduced the Thermo Scientific Meridian EX System— an electron-beam-based failure analysis solution designed to enable precise fault localization on advanced semiconductor logic technologies that helps users localize defects within complex power networks and achieve 10X improvement in spatial resolution compared to optical fault isolation solutions.
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Phase3D, Chicago, Ill., has been awarded a two-year 1.25 million USD contract from the Air Force Research Lab (AFRL) to develop a quality inspection system for cold spray additive manufacturing.
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North Star Imaging, Rogers, MN, recently opened an x-ray inspection services laboratory in Orlando, Florida. The facility houses a vault with a 9 Million Electron Volt high energy CT X-ray system capable of scanning very large dense parts used in aerospace and aviation.
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