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Effect Of Thermal Aging On Microstructure And Mechanical Property Of Sn-Bi-Ag And Sn-Bi-In Solder Joints On Cu Substrate
Authors: Xu Chen, Feng Xue, Jian Zhou, Yao Yao
In this study, the effect of thermal aging on microstructure and mechanical property of Sn-Bi based solder including Sn-Bi-Ag and Sn-Bi-In joints on Cu substrate were investigated. The results show that the addition of Ag increases tensile strength but the elongation dropped adding more Ag.
Authors: Yao Yao, Feng Xue, Jian Zhou, Xu Chen
Diffusion and interfacial reactions of Sn-9Zn and Sn-3.5Ag solders on aluminum substrates during soldering process including their mechanical properties were investigated in this study. In Sn-9Zn/Al solder joints, Al substrate was dissolved by melted solder.
Assessment Of Wettability For Sn-0.7Wt%Cu-(0-1,000 Ppm Ni) Lead-Free Solder Alloys On Copper Substrates
Authors: Bismarck, L .S .; Cheung, N .; Garcia, A .; Spinelli, J.E.
Among several properties required for lead-free solders in electronic industry, the wettability is an important factor, since it defines the tendency for a liquid metal to spread on a solid surface. Sn-Cu alloys are interesting Pb-free alternative solder, because present low cost when compared with the other lead-free solders. Microadditions of Ni can improve the wetting behavior of Sn-Cu-Ni alloys.
Effects Of Metallic Nanoparticle Doped Flux On Interfacial Intermetallic Compounds Between Lead Free Solder Ball And Cu Substrate
Authors: G. K. Sujan, A.S.M.A. Haseeb, Amalina Afifi
This work investigates the effects of metallic nanoparticle doped flu x on the morphology and growth of interfacial IMC layers. Four different metallic nanoparticles (Ni, Co, Mo and Ti) were investigated by incorporating them in a water soluble commercial flu x on a copper substrate.
Authors: Hao ZHANG, Shijo NAGAO, Katsuaki, SUGANUMA
Lead-free die-attach materials for SiC power semiconductor devices are urgently needed because of the rapid development of renewable energy technologies. Hybrid Ag pastes consist of micron-sized Ag flakes hybridized with submicron-sized Ag particles are considered as a potential candidate.
Authors: E. Eshed, M. Bamberger, A. Katsman
Manufacturing amorphous Mg-based alloys is expected to combine their naturally low specific weight with high corrosion resistance and improved mechanical properties.
Authors: H.M. Al-Jabr, J.G. Speer, D.K. Matlock
The effects of microstructure and cyrstallographic texture in four commercially-produced API X70 pipeline steels and their relation to planar anisotropy of toughness were evaluated.
The Design Of Microstructure For Strength And Toughness In Low Carbon High Strength Bainite Using Ebsd Techniques
Authors: Xiaojun Liang , Yu Gong, Bing Ma, Anthony J. D
Low carbon high strength plate steels with yield strengths over 560 MPa require bainite dominated microstructures to achieve high strength, high toughness and good weldability in pipeline or other plate steel applications.
Authors: D. Jorge-Badiola, C.-P. Reip and J.M. Rodriguez-Ibabe
The combined requirement of higher strength and toughness in HSLA steels has led to the development of thermomechanical processes able to provide more complex microstructures. The constituents of these microstructures can intervene in different ways than those observed in conventional grades when brittle fracture processes are intended to shift to lower temperatures.
Authors: Bing Ma, Xiaojun Liang, Yeol-Rae Cho, Yu Gong, Anthony J. DeArdo
Hot press forming or hot stamping followed by in-die quenching, can result in body-in-white components with very high strength and very little springback.