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Effect Of Thermal Aging On Microstructure And Mechanical Property Of Sn-Bi-Ag And Sn-Bi-In Solder Joints On Cu Substrate

Published: 2014
Authors: Xu Chen, Feng Xue, Jian Zhou, Yao Yao

In this study, the effect of thermal aging on microstructure and mechanical property of Sn-Bi based solder including Sn-Bi-Ag and Sn-Bi-In joints on Cu substrate were investigated. The results show that the addition of Ag increases tensile strength but the elongation dropped adding more Ag.

Material Resources / Publications

Interfacial Reactions Of Sn-9Zn/Al And Sn-3.5Ag/Al Solder Joints During Soldering Process

Published: 2014
Authors: Yao Yao, Feng Xue, Jian Zhou, Xu Chen

Diffusion and interfacial reactions of Sn-9Zn and Sn-3.5Ag solders on aluminum substrates during soldering process including their mechanical properties were investigated in this study. In Sn-9Zn/Al solder joints, Al substrate was dissolved by melted solder.

Material Resources / Publications

Assessment Of Wettability For Sn-0.7Wt%Cu-(0-1,000 Ppm Ni) Lead-Free Solder Alloys On Copper Substrates

Published: 2014
Authors: Bismarck, L .S .; Cheung, N .; Garcia, A .; Spinelli, J.E.

Among several properties required for lead-free solders in electronic industry, the wettability is an important factor, since it defines the tendency for a liquid metal to spread on a solid surface. Sn-Cu alloys are interesting Pb-free alternative solder, because present low cost when compared with the other lead-free solders. Microadditions of Ni can improve the wetting behavior of Sn-Cu-Ni alloys.

Material Resources / Publications

Effects Of Metallic Nanoparticle Doped Flux On Interfacial Intermetallic Compounds Between Lead Free Solder Ball And Cu Substrate

Published: 2014
Authors: G. K. Sujan, A.S.M.A. Haseeb, Amalina Afifi

This work investigates the effects of metallic nanoparticle doped flu x on the morphology and growth of interfacial IMC layers. Four different metallic nanoparticles (Ni, Co, Mo and Ti) were investigated by incorporating them in a water soluble commercial flu x on a copper substrate.

Material Resources / Publications

Sic Die-Attach On Dba Substrate With Ceramic Nano-Particles Added Hybrid Ag Particle Paste

Published: 2014
Authors: Hao ZHANG, Shijo NAGAO, Katsuaki, SUGANUMA

Lead-free die-attach materials for SiC power semiconductor devices are urgently needed because of the rapid development of renewable energy technologies. Hybrid Ag pastes consist of micron-sized Ag flakes hybridized with submicron-sized Ag particles are considered as a potential candidate.

Material Resources / Publications

Phase Stability And Glass-Forming Ability Of Mg-Based Ternary Alloys

Published: 2014
Authors: E. Eshed, M. Bamberger, A. Katsman

Manufacturing amorphous Mg-based alloys is expected to combine their naturally low specific weight with high corrosion resistance and improved mechanical properties.

Material Resources / Publications

Toughness Anisotropy In Four X70 Pipeline Steels Produced Via Different Rolling Practices

Published: 2014
Authors: H.M. Al-Jabr, J.G. Speer, D.K. Matlock

The effects of microstructure and cyrstallographic texture in four commercially-produced API X70 pipeline steels and their relation to planar anisotropy of toughness were evaluated.

Material Resources / Publications

The Design Of Microstructure For Strength And Toughness In Low Carbon High Strength Bainite Using Ebsd Techniques

Published: 2014
Authors: Xiaojun Liang , Yu Gong, Bing Ma, Anthony J. D

Low carbon high strength plate steels with yield strengths over 560 MPa require bainite dominated microstructures to achieve high strength, high toughness and good weldability in pipeline or other plate steel applications.

Material Resources / Publications

Microstructural Features Intervening In Brittle Processes In Microalloyed High Strength Steels

Published: 2014
Authors: D. Jorge-Badiola, C.-P. Reip and J.M. Rodriguez-Ibabe

The combined requirement of higher strength and toughness in HSLA steels has led to the development of thermomechanical processes able to provide more complex microstructures. The constituents of these microstructures can intervene in different ways than those observed in conventional grades when brittle fracture processes are intended to shift to lower temperatures.

Material Resources / Publications

Deformation And Fracture Characteristics Of Hot Press Formed Steels

Published: 2014
Authors: Bing Ma, Xiaojun Liang, Yeol-Rae Cho, Yu Gong, Anthony J. DeArdo

Hot press forming or hot stamping followed by in-die quenching, can result in body-in-white components with very high strength and very little springback.

Material Resources / Publications

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