{"version":"1.0","provider_name":"Electronic Device Failure Analysis Society","provider_url":"https:\/\/www.asminternational.org\/edfas","author_name":"Debbie Sniderman","author_url":"https:\/\/www.asminternational.org\/edfas\/author\/dsniderman\/","title":"2D material reshapes 3D electronics for AI hardware - Electronic Device Failure Analysis Society","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"MbGCymmLQs\"><a href=\"https:\/\/www.asminternational.org\/edfas\/2d-material-reshapes-3d-electronics-for-ai-hardware\/\">2D material reshapes 3D electronics for AI hardware<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.asminternational.org\/edfas\/2d-material-reshapes-3d-electronics-for-ai-hardware\/embed\/#?secret=MbGCymmLQs\" width=\"600\" height=\"338\" title=\"&#8220;2D material reshapes 3D electronics for AI hardware&#8221; &#8212; Electronic Device Failure Analysis Society\" data-secret=\"MbGCymmLQs\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/www.asminternational.org\/app\/uploads\/sites\/41\/2023\/12\/EDFAS__121423__WU__250.jpg","thumbnail_width":250,"thumbnail_height":153,"description":"An international team, including researchers from Washington University in St. Louis, Massachusetts Institute of Technology, Yonsei University and Inha University in Korea, Georgia Institute of Technology, and the University of Notre Dame, has demonstrated the monolithic 3D integration of layered 2D material into novel processing hardware, addressing the challenge of increased information transfer time between functional components in advanced computer chips and paving the way for AI computing."}