{"version":"1.0","provider_name":"Electronic Device Failure Analysis Society","provider_url":"https:\/\/www.asminternational.org\/edfas","author_name":"Electronic Device Failure Analysis Society","author_url":"https:\/\/www.asminternational.org\/edfas","title":"ISTFA Conference Proceedings - Electronic Device Failure Analysis Society","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"N3gowXZs84\"><a href=\"https:\/\/www.asminternational.org\/edfas\/istfa-conference-proceedings\/\">ISTFA Conference Proceedings<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/www.asminternational.org\/edfas\/istfa-conference-proceedings\/embed\/#?secret=N3gowXZs84\" width=\"600\" height=\"338\" title=\"&#8220;ISTFA Conference Proceedings&#8221; &#8212; Electronic Device Failure Analysis Society\" data-secret=\"N3gowXZs84\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/* ]]> *\/\n<\/script>\n","description":"ISTFA Proceedings The\u00a0International Symposium for Testing and Failure Analysis\u00a0is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques. EDFAS Proceedings are free to EDFAS Members as part of your member benefit package. View proceedings digitally in the library","thumbnail_url":"https:\/\/asm.silverchair-cdn.com\/ImageLibrary\/ISTFA_Conference-Proceedings-Cover.jpg?versionId=1675"}