{"id":110,"date":"2014-05-28T14:07:47","date_gmt":"2014-05-28T14:07:47","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/about\/whats-new\/"},"modified":"2014-05-28T14:07:47","modified_gmt":"2014-05-28T14:07:47","slug":"whats-new","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/","title":{"rendered":"What’s New"},"content":{"rendered":"

What’s New<\/h1>\n

Microelectronics Failure Analysis Desk Reference, Seventh Edition (print) is up on the website<\/h3>\n

EDFAS proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference<\/i>, published by ASM International, available this fall. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. asminternational.org\/microelectronicsfa<\/a><\/span><\/span><\/span><\/span><\/p>\n

EDFAS members have access to the content as a member benefit. Look for it in the ASM Digital Library<\/a> later this year.<\/span><\/span><\/span><\/span><\/p>\n

\n

View the article EDFA as  Portal to the World of Failure Analysis<\/h3>\n

EDFA as a Portal to the World of Failure Analysis: Read this intriguing Guest Column by Dave Burgess<\/a><\/strong><\/p>\n

\n

View the EDFA  <\/em>Digital Edition<\/h3>\n

EDFA <\/em>magazine is available as a Digital Edition in addition to print. View a sample issue. Or for EDFAS members, access your EDFA <\/em>magazine Digital Edition, which is a member benefit.<\/p>\n

View additional details ><\/a><\/p>\n

\n

View new Webinar Recording on Smarter Benchtop Test for Reduced Turnaround Time<\/h3>\n

View this free webinar recording and other titles of interest to the EDFAS community.<\/p>\n

View additional details ><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

What’s New Microelectronics Failure Analysis Desk Reference, Seventh Edition (print) is up on the website EDFAS proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International, available this fall. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures…. View Article<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"parent":18,"menu_order":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-110","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"\nWhat's New - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"What's New - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"What’s New Microelectronics Failure Analysis Desk Reference, Seventh Edition (print) is up on the website EDFAS proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International, available this fall. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures.... View Article\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/about\\\/whats-new\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/about\\\/whats-new\\\/\",\"name\":\"What's New - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2014-05-28T14:07:47+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/about\\\/whats-new\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/about\\\/whats-new\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/about\\\/whats-new\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"About\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/about\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"What’s New\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"What's New - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/","og_locale":"en_US","og_type":"article","og_title":"What's New - Electronic Device Failure Analysis Society","og_description":"What’s New Microelectronics Failure Analysis Desk Reference, Seventh Edition (print) is up on the website EDFAS proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International, available this fall. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures.... View Article","og_url":"https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/","og_site_name":"Electronic Device Failure Analysis Society","twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/","url":"https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/","name":"What's New - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2014-05-28T14:07:47+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/about\/whats-new\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"About","item":"https:\/\/www.asminternational.org\/edfas\/about\/"},{"@type":"ListItem","position":3,"name":"What’s New"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/110","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=110"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/110\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/18"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=110"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}