{"id":119,"date":"2014-05-28T15:37:34","date_gmt":"2014-05-28T15:37:34","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/technical\/desk-reference\/"},"modified":"2022-10-18T10:48:04","modified_gmt":"2022-10-18T10:48:04","slug":"desk-reference","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/technical\/desk-reference\/","title":{"rendered":"Microelectronics Desk Reference"},"content":{"rendered":"<h1>Access to Desk Reference<\/h1>\n<p>As part of your EDFAS membership, you have access to&nbsp;<em>Microelectronics Failure Analysis Desk Reference, <\/em>Seventh&nbsp;Edition, which contains the items listed below.&nbsp; In order to view this content please visit your&nbsp;<a href=\"https:\/\/eportal.asminternational.org\/eportal\/CPBase__profile\">My EDFAS<\/a>&nbsp;page.<\/p>\n<p>Once there, please select the My Content&nbsp;tab on the left; here your will find all of your ASM\/EDFAS content including the&nbsp;<em>Microelectronics Failure Analysis Desk Reference, <\/em>Seventh&nbsp;Edition.<\/p>\n<p>The<i> Microelectronics Failure Analysis, Desk Reference, <\/i>Seventh Edition offers comprehensive information on advanced failure analysis tools and techniques, illustrated with real-life examples. This book includes information to help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Topics include:<\/p>\n<ul>\n<li class=\"CxSpMiddle\" style=\"margin-bottom:8.0pt\">\n<p><span style=\"line-height:105%\">Failure analysis process and management, including wafer, package, and board level failure analysis flow<\/span><\/p>\n<\/li>\n<li class=\"CxSpMiddle\" style=\"margin-bottom:8.0pt\">\n<p><span style=\"line-height:105%\">Incoming inspection tools, including optical, x-ray, and scanning acoustic microscopy<\/span><\/p>\n<\/li>\n<li class=\"CxSpMiddle\" style=\"margin-bottom:8.0pt\">\n<p><span style=\"line-height:105%\">Fault isolation, including front and backside sample preparation, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermography, laser voltage probing (LVP), photon emission, EOTPR\/TDR\/TDT, and current imaging<\/span><\/p>\n<\/li>\n<li class=\"CxSpMiddle\" style=\"margin-bottom:8.0pt\">\n<p><span style=\"line-height:105%\">Device and circuit characterization, including scanning electron microscopy (SEM)-based and atomic force microscopy (AFM)-based nanoprobing<\/span><\/p>\n<\/li>\n<li class=\"CxSpMiddle\" style=\"margin-bottom:8.0pt\">\n<p><span style=\"line-height:105%\">FIB technique and circuit edit, including FIB overview and advanced circuit edit for first silicon debug<\/span><\/p>\n<\/li>\n<li class=\"CxSpMiddle\" style=\"margin-bottom:8.0pt\">\n<p><span style=\"line-height:105%\">Physical analysis, including deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron microscopy (TEM), and scanning probe microscopy<\/span><\/p>\n<\/li>\n<li class=\"CxSpMiddle\" style=\"margin-bottom:8.0pt\">\n<p><span style=\"line-height:105%\">Memory FA, including DRAM and semiconductor memory failure signature analysis<\/span><\/p>\n<\/li>\n<li class=\"CxSpMiddle\" style=\"margin-bottom:8.0pt\">\n<p><span style=\"line-height:105%\">Special applications, including automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics<\/span><\/p>\n<\/li>\n<li class=\"CxSpMiddle\" style=\"margin-bottom:8.0pt\">\n<p><span style=\"line-height:105%\">Fundamental topics, including integrated circuit testing, analog design, reliability, quality, training, and definitions of FA terms<\/span><\/p>\n<\/li>\n<\/ul>\n<p>For information on the print version <a href=\"https:\/\/www.asminternational.org\/search\/-\/journal_content\/56\/10192\/38278573\/PUBLICATION\" target=\"_blank\" rel=\"noopener\">follow this link<\/a>.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Access to Desk Reference As part of your EDFAS membership, you have access to&nbsp;Microelectronics Failure Analysis Desk Reference, Seventh&nbsp;Edition, which contains the items listed below.&nbsp; In order to view this content please visit your&nbsp;My EDFAS&nbsp;page. Once there, please select the My Content&nbsp;tab on the left; here your will find all of your ASM\/EDFAS content including&#8230; <a class=\"view-article\" href=\"https:\/\/www.asminternational.org\/edfas\/technical\/desk-reference\/\">View Article<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"parent":30,"menu_order":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-119","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Microelectronics Desk Reference - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/technical\/desk-reference\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Microelectronics Desk Reference - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Access to Desk Reference As part of your EDFAS membership, you have access to&nbsp;Microelectronics Failure Analysis Desk Reference, Seventh&nbsp;Edition, which contains the items listed below.&nbsp; In order to view this content please visit your&nbsp;My EDFAS&nbsp;page. 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View Article","og_url":"https:\/\/www.asminternational.org\/edfas\/technical\/desk-reference\/","og_site_name":"Electronic Device Failure Analysis Society","article_modified_time":"2022-10-18T10:48:04+00:00","twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/technical\/desk-reference\/","url":"https:\/\/www.asminternational.org\/edfas\/technical\/desk-reference\/","name":"Microelectronics Desk Reference - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2014-05-28T15:37:34+00:00","dateModified":"2022-10-18T10:48:04+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/technical\/desk-reference\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/technical\/desk-reference\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/technical\/desk-reference\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Technical Resources","item":"https:\/\/www.asminternational.org\/edfas\/technical\/"},{"@type":"ListItem","position":3,"name":"Microelectronics Desk Reference"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/119","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=119"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/119\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/30"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=119"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}