{"id":131,"date":"2014-06-03T16:40:44","date_gmt":"2014-06-03T16:40:44","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/2018_photo\/2009-2\/"},"modified":"2022-11-23T06:33:10","modified_gmt":"2022-11-23T06:33:10","slug":"2009-2","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/","title":{"rendered":"2009"},"content":{"rendered":"<h1>2009 Photo Contest Winners<\/h1>\n<table border=\"1\" width=\"700\" cellspacing=\"0\" cellpadding=\"1\">\n<tbody>\n<tr>\n<td class=\"title\" style=\"width: 598px;\" colspan=\"2\" height=\"61\"><strong>Congratulations to the 2009 winners!<\/strong><\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td style=\"width: 598px;\" colspan=\"2\" height=\"20\"><a id=\"color\" name=\"color\"><\/a>\u00a0<strong>Category I: Color Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td class=\"place_text\" style=\"width: 211px;\" valign=\"top\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 160px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2009CO_1.jpg\" alt=\"\" \/>.<\/p>\n<p style=\"text-align: center;\">Deborah Romero<br \/>\nInternational Rectifier Corporation<\/p>\n<p>An image of an EOS site after decapsulation of a power device. It looks like a smiley face.<\/td>\n<td class=\"lessontitle\" style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 200px; height: 173px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2009CO_2.jpg\" alt=\"\" \/><br \/>\nHamid Kashani<br \/>\nCOM DEV International Ltd.<\/p>\n<p>This photo is taken from the flush terminal contact of an<br \/>\nisolator after etching. Due to inadequate degolding, gold-tin<br \/>\nintermetallics were formed during the soldering process.<br \/>\nThe joint embrittlement had led to the crack in the solder.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\"><strong>3rd Place:\u00a0<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 151px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2009CO_3.jpg\" alt=\"\" \/><br \/>\nJin Won Koh<br \/>\nNational Nanofab Center<\/p>\n<p>Optical microscope view of the solor cell texture which has an efficiency failure.<\/td>\n<td style=\"width: 387px;\">\n<p align=\"center\">\n<\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td style=\"width: 598px;\" colspan=\"2\"><a id=\"bw\" name=\"bw\"><\/a><strong>\u00a0<\/strong><strong>Category II: Black and White Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 170px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2009BW_1.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Kok Peng Yeoh, Zhengkun Ma, Zhiyong Wang<br \/>\nIntel Corporaiton<\/p>\n<p>Revealed petaline metal flakes that caused short between 2 first level interconnect bumps in an assembled flip chip package.<\/p>\n<p style=\"text-align: center;\">\n<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><strong>\u00a0<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 200px; height: 150px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2009BW_2.jpg\" alt=\"\" \/><\/p>\n<p>Robert Wilkin, Whitney West, Tyler Lenzi<br \/>\nMicron<\/p>\n<p>Gallium Nitride film etched with 8 minutes of 260C<br \/>\nPotassium Hydroxide to determine density for each<br \/>\nof the different types of dislocations present in the film.<\/p>\n<p>&nbsp;<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>3rd Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 136px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2009BW_3.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Jack Borgeson<br \/>\nGoodrich<\/p>\n<p>Fracture lines in the lower region allowed for identification of the origination point of physical stress to the controller IC. The IC failed hot and the metallization reflowed out of structures leaving the appearance of Native American cliff dwellings such as that of the Hohokam in Arizona.<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td class=\"blue_borderbottom\" style=\"width: 598px;\" colspan=\"2\"><a id=\"false\" name=\"false\"><\/a><strong>\u00a0<\/strong><strong>Category III: False Color Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 160px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2009FC_1 %281%29.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Sumanth Thirunavukkarasu, Jerome Pons<br \/>\nNanolab Technologies<\/p>\n<p>3D Tomograph of Press Fit Pins in a Printed Circuit Board. Single press fits pins on the side show different levels of fading to show various depths of details.<\/p>\n<p style=\"text-align: center;\">\n<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 200px; height: 175px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2009FC_2.jpg\" alt=\"\" \/><\/p>\n<p>Natasha Erdman, Ph.D., N. Kikuchi, R. Campbell<br \/>\nJEOL USA<\/p>\n<p>Passive voltage contrast of metal lines of de-processed<br \/>\n(&#8220;finger lapped&#8221;) IC. Blue lines are going to ground, orange<br \/>\nlines float. SE Image taken using 0.3 kV, then false-colored.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>3rd Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 200px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2009FC_3.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Valentin Kulikov<\/p>\n<p>Image shows photoemission center, acquired by Hamamtsu Phemos-1000 microscope, within output diode of CMOS circircuitry. This diode caused pin leakage which resulted into CMOS unit failure. The root cause was found and determined as remaining PolySi at active area border which together with KOI defect led to diode.<\/p>\n<p style=\"text-align: center;\">\n<p>&nbsp;<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>2009 Photo Contest Winners Congratulations to the 2009 winners! \u00a0Category I: Color Images 1st Place: . Deborah Romero International Rectifier Corporation An image of an EOS site after decapsulation of a power device. It looks like a smiley face. 2nd Place: Hamid Kashani COM DEV International Ltd. This photo is taken from the flush terminal&#8230; <a class=\"view-article\" href=\"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/\">View Article<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"parent":1297,"menu_order":55,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-131","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>2009 - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"2009 - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"2009 Photo Contest Winners Congratulations to the 2009 winners! \u00a0Category I: Color Images 1st Place: . 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View Article\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:modified_time\" content=\"2022-11-23T06:33:10+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/events\\\/photo-contest\\\/2009-2\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/events\\\/photo-contest\\\/2009-2\\\/\",\"name\":\"2009 - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2014-06-03T16:40:44+00:00\",\"dateModified\":\"2022-11-23T06:33:10+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/events\\\/photo-contest\\\/2009-2\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/events\\\/photo-contest\\\/2009-2\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/events\\\/photo-contest\\\/2009-2\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Events\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/events\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Photo Contest\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/events\\\/photo-contest\\\/\"},{\"@type\":\"ListItem\",\"position\":4,\"name\":\"2009\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"2009 - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/","og_locale":"en_US","og_type":"article","og_title":"2009 - Electronic Device Failure Analysis Society","og_description":"2009 Photo Contest Winners Congratulations to the 2009 winners! \u00a0Category I: Color Images 1st Place: . Deborah Romero International Rectifier Corporation An image of an EOS site after decapsulation of a power device. It looks like a smiley face. 2nd Place: Hamid Kashani COM DEV International Ltd. This photo is taken from the flush terminal... View Article","og_url":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/","og_site_name":"Electronic Device Failure Analysis Society","article_modified_time":"2022-11-23T06:33:10+00:00","twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/","url":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/","name":"2009 - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2014-06-03T16:40:44+00:00","dateModified":"2022-11-23T06:33:10+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2009-2\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Events","item":"https:\/\/www.asminternational.org\/edfas\/events\/"},{"@type":"ListItem","position":3,"name":"Photo Contest","item":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/"},{"@type":"ListItem","position":4,"name":"2009"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/131","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=131"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/131\/revisions"}],"up":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/1297"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=131"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}