{"id":132,"date":"2014-06-03T16:54:08","date_gmt":"2014-06-03T16:54:08","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/2018_photo\/2008-2\/"},"modified":"2022-11-23T06:33:18","modified_gmt":"2022-11-23T06:33:18","slug":"2008-2","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2008-2\/","title":{"rendered":"2008"},"content":{"rendered":"<h1>2008 Photo Contest Winners<\/h1>\n<table border=\"1\" width=\"700\" cellspacing=\"0\" cellpadding=\"1\">\n<tbody>\n<tr>\n<td class=\"title\" style=\"width: 598px;\" colspan=\"2\" height=\"61\"><strong>Congratulations to the 2008 winners!<\/strong><\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td style=\"width: 598px;\" colspan=\"2\" height=\"20\"><a id=\"color\" name=\"color\"><\/a>\u00a0<strong>Category I: Color Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td class=\"place_text\" style=\"width: 211px;\" valign=\"top\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><strong><img decoding=\"async\" style=\"width: 200px; height: 150px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/Color1.jpg\" alt=\"\" \/><\/strong><\/p>\n<p style=\"text-align: center;\">Hamid Kashani<br \/>\nCOM DEV International, Ltd., Cambridge, Ontario<\/p>\n<p>This photo is taken from a gold plated via hole of an alumina PCB. The significance of the photo is to indicate that the cracks on gold plating are initiated from the alumina substrate. Photo is taken by focusing<br \/>\nthrough an extended depth of field of 10 mils to follow the cracks from cross-sectioned via.<\/td>\n<td class=\"lessontitle\" style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><\/p>\n<p><strong><img decoding=\"async\" style=\"width: 200px; height: 150px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/Color2.jpg\" alt=\"\" \/><\/strong><\/p>\n<p>Carl Nail<\/p>\n<p>National Semiconductor, Santa Clara, California<br \/>\nTwo pads shorted due to copper dendritic growth<br \/>\ncaused by acid residue from PCB manufacturing<br \/>\nprocess. Board was back-ground and viewed from the<br \/>\nback through the remaining board resin. Darkfield<br \/>\nillumination, 200x.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\"><strong>3rd Place:\u00a0<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 150px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/Color3.jpg\" alt=\"\" \/><br \/>\nKen Turner<\/p>\n<p>Hi-Rel Laboratories, Spokane, Washington<\/p>\n<p>Copper dendrites in a FET resulting from the corrosion of the header material.<\/td>\n<td style=\"width: 387px;\">\n<p align=\"center\">\n<\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td style=\"width: 598px;\" colspan=\"2\"><a id=\"bw\" name=\"bw\"><\/a><strong>\u00a0<\/strong><strong>Category II: Black and White Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 202px; height: 152px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/BW1.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Rafael Huerta<\/p>\n<p>National Semiconductor, Santa Clara, California<\/p>\n<p>Roots of ESD. This is ESD damage\/short between Emitter\/Collector regions on a device. Silicon has migrated from an emitter region shorting out to a collector region.<\/p>\n<p style=\"text-align: center;\">\n<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><strong>\u00a0<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 198px; height: 161px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/BW2.jpg\" alt=\"\" \/><\/p>\n<p>Michael Drake<\/p>\n<p>Intel Corporation, Chandler, Arizona<\/p>\n<p>SEM image of &#8220;sea star&#8221; corrosion formations on<br \/>\nmotherboard socket j-lead that caused contact high<br \/>\nresistance\/open failure.\n<\/p><\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>3rd Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 184px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/BW3.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">J\u00e9r\u00f4me Pons and Nathan Folsom<\/p>\n<p>Nanolab Technologies, San Jose, California<\/p>\n<p>The image represents a defect at poly level.<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td class=\"blue_borderbottom\" style=\"width: 598px;\" colspan=\"2\"><a id=\"false\" name=\"false\"><\/a><strong>\u00a0<\/strong><strong>Category III: False Color Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 199px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/FC1.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">\nDr. Natasha Erdman and Vern Robertson<\/p>\n<p>JEOL USA, Peabody, Massachusetts<\/p>\n<p>An EBSD (Electron Backscatter Diffraction) map of a wire bond, showing grain size and crystallographic grain orientation. The colors represent the crystals&#8217; relative<br \/>\nposition in 3D space with respect to one another in an x, y,z (H,K,L) coordinate system. The cross section of the<br \/>\nsample was prepared with the JEOL CP ion polisher.<\/p>\n<p style=\"text-align: center;\">\n<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 147px; height: 200px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/FC2.jpg\" alt=\"\" \/><\/p>\n<p>Jim Colvin<\/p>\n<p>FA Instruments, San Jose, California<\/p>\n<p>Combinational analysis using OBIC\/SIFT laser<br \/>\nscan of a poly resistor at 654nm. No signal<br \/>\nwas found in this area using TIVA\/OBIRCH<br \/>\nstyle techniques. INSB thermal is shown<br \/>\nin the upper right inset image identifying the<br \/>\nleakage source.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>3rd Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 200px; height: 151px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/FC3.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Roger Yacobucci<\/p>\n<p>LSI Corp., Fort Collins, Colorado<\/p>\n<p>Laser scanning microscope image of damage located between the top metal layers of the seal ring and two input buffers. The flip chip device was de-processed while still attached to the package substrate and the view is from the backside of a mechanically thinned device.<\/p>\n<p style=\"text-align: center;\">\n<p>&nbsp;<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>2008 Photo Contest Winners Congratulations to the 2008 winners! \u00a0Category I: Color Images 1st Place: Hamid Kashani COM DEV International, Ltd., Cambridge, Ontario This photo is taken from a gold plated via hole of an alumina PCB. The significance of the photo is to indicate that the cracks on gold plating are initiated from the&#8230; <a class=\"view-article\" href=\"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2008-2\/\">View Article<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"parent":1297,"menu_order":66,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-132","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>2008 - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2008-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"2008 - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"2008 Photo Contest Winners Congratulations to the 2008 winners! \u00a0Category I: Color Images 1st Place: Hamid Kashani COM DEV International, Ltd., Cambridge, Ontario This photo is taken from a gold plated via hole of an alumina PCB. 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