{"id":134,"date":"2014-06-03T17:42:46","date_gmt":"2014-06-03T17:42:46","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/2018_photo\/2006-2\/"},"modified":"2022-11-23T06:33:32","modified_gmt":"2022-11-23T06:33:32","slug":"2006-2","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2006-2\/","title":{"rendered":"2006"},"content":{"rendered":"<h1>2006 Photo Contest Winners<\/h1>\n<table border=\"1\" width=\"700\" cellspacing=\"0\" cellpadding=\"1\">\n<tbody>\n<tr>\n<td class=\"title\" style=\"width: 598px;\" colspan=\"2\" height=\"61\"><strong>Congratulations to the 2006 winners!<\/strong><\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td style=\"width: 598px;\" colspan=\"2\" height=\"20\"><a id=\"color\" name=\"color\"><\/a>\u00a0<strong>Category I: Color Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td class=\"place_text\" style=\"width: 211px;\" valign=\"top\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><strong><img decoding=\"async\" style=\"width: 250px; height: 188px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2006CO_1st.jpg\" alt=\"\" \/><\/strong><\/p>\n<p style=\"text-align: center;\">Bill Morrow<br \/>\nMEFAS Inc, Lake Forest, California, USA<\/p>\n<p>EOS damaged thin film resistor on a GaAs substrate.<\/p>\n<p style=\"text-align: center;\">\n<\/td>\n<td class=\"lessontitle\" style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 250px; height: 188px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2006CO_2nd.jpg\" alt=\"\" \/><br \/>\nRamesh Kuchibhatla<\/p>\n<p>Semiconductor Insights, Kanata, Ontario, Canada<\/p>\n<p>Optical Topographical view of a<br \/>\nlaser end seen through the lens.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\"><strong>3rd Place:\u00a0<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 250px; height: 188px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2006CO_3rd.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Vincent Liew<\/p>\n<p>Micron Semi Asia, Singapore<\/p>\n<p>Passivation delamination<\/td>\n<td style=\"width: 387px;\">\n<p align=\"center\">\n<\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td style=\"width: 598px;\" colspan=\"2\"><a id=\"bw\" name=\"bw\"><\/a><strong>\u00a0<\/strong><strong>Category II: Black and White Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 250px; height: 216px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2006BW_1st.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Zachary Gemmill<\/p>\n<p>National Semiconductor, Santa Clara, California, USA<\/p>\n<p>&#8220;Hardened Artery.&#8221; FIB cross-section of a copper wire showing oxidation layers after thermal stress. (secondary electron image taken with the ion beam)<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><strong>\u00a0<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 250px; height: 188px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2006BW_2nd.jpg\" alt=\"\" \/><\/p>\n<p>Choong Pin Joey Phua<\/p>\n<p>AMD, Singapore<\/p>\n<p>This shows transistors of an SOI device.<br \/>\nThe chip is deprocessed from the<br \/>\nbackside with bulk silicon, box and active silicon removed, revealing the<br \/>\nchannel, nitride spacer and the COSI.<br \/>\nThis is useful for salicide defect<br \/>\ninspection from the backside of the die.<\/p>\n<p>&nbsp;<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>3rd Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 250px; height: 195px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2006BW_3rd.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Sue Brown<\/p>\n<p>Semiconductor Insights, Kanata, Ontario, Canada<\/p>\n<p>SEM view of dendritic growth on surface of an IC<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td class=\"blue_borderbottom\" style=\"width: 598px;\" colspan=\"2\"><a id=\"false\" name=\"false\"><\/a><strong>\u00a0<\/strong><strong>Category III: False Color Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 250px; height: 207px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2006FC_1st.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Tsan-Cheng Chuang<br \/>\nCha-Ming Shen<br \/>\nJon C. Lee<\/p>\n<p>TSMC, Tainan, Taiwan, ROC<\/p>\n<p>SCM image (Scanning Capacitance Microscope) showed that P+ doping concentration\/distribution abnormal was revealed at VDD node.<\/p>\n<p style=\"text-align: center;\">\n<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 250px; height: 144px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2006FC_2nd.jpg\" alt=\"\" \/><\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>Ramesh Kuchibhatla<\/p>\n<p>Semiconductor Insights, Kanata, Ontario, Canada<\/p>\n<p>Optical Image of a III-V, LaserDiode<br \/>\ncreated using Linear Local Level<br \/>\nEquilization Technique.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\">\n<p style=\"text-align: center;\"><strong>3rd Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 250px; height: 253px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/2006FC_3rd.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Hadi Winata<\/p>\n<p>Micron Semi Asia, Singapore<\/p>\n<p>Backside Emmission<\/p>\n<p style=\"text-align: center;\">\n<p>&nbsp;<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>2006 Photo Contest Winners Congratulations to the 2006 winners! \u00a0Category I: Color Images 1st Place: Bill Morrow MEFAS Inc, Lake Forest, California, USA EOS damaged thin film resistor on a GaAs substrate. 2nd Place: Ramesh Kuchibhatla Semiconductor Insights, Kanata, Ontario, Canada Optical Topographical view of a laser end seen through the lens. 3rd Place:\u00a0 Vincent&#8230; <a class=\"view-article\" href=\"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2006-2\/\">View Article<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"parent":1297,"menu_order":88,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-134","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>2006 - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/events\/photo-contest\/2006-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"2006 - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"2006 Photo Contest Winners Congratulations to the 2006 winners! \u00a0Category I: Color Images 1st Place: Bill Morrow MEFAS Inc, Lake Forest, California, USA EOS damaged thin film resistor on a GaAs substrate. 2nd Place: Ramesh Kuchibhatla Semiconductor Insights, Kanata, Ontario, Canada Optical Topographical view of a laser end seen through the lens. 3rd Place:\u00a0 Vincent... 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