{"id":135,"date":"2014-06-03T17:55:10","date_gmt":"2014-06-03T17:55:10","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/2018_photo\/103-2\/"},"modified":"2022-11-23T06:34:27","modified_gmt":"2022-11-23T06:34:27","slug":"103-2","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/103-2\/","title":{"rendered":"2005"},"content":{"rendered":"

2005 Photo Contest Winners<\/h1>\n\n\n\n\n\n\n\n\n\n\n\n\n
Congratulations to the 2005 winners!<\/strong><\/td>\n<\/tr>\n
<\/a>\u00a0Category I: Color Images<\/strong><\/td>\n<\/tr>\n
1st Place:<\/strong><\/p>\n

\"\"<\/p>\n

Andrew Woodard
\nSemiconductor Insights, Ontario, Canada<\/p>\n

Light diffracting off decapped microcontroller<\/p>\n

\n<\/td>\n

\n
\n

2nd Place:<\/strong><\/p>\n

\"\"
\nWong Yaw Yuan<\/p>\n

Micron Semiconductor, Asia<\/p>\n

Leaf pattern with bubble like void observed on
\nthe die attached tape after delamination occur
\ndue to insufficient cure of polyimide.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n

3rd Place:\u00a0<\/strong><\/p>\n

\"\"<\/p>\n

Mark Lam Tiam Weng<\/p>\n

Institute of Microelectronics A-Star, Singapore<\/p>\n

Electronic Foetus – Birth of a chip. Defect on ECP copper before CMP looks like a foetus developing.<\/td>\n

\n

\n<\/td>\n<\/tr>\n

<\/a>\u00a0<\/strong>Category II: Black and White Images<\/strong><\/td>\n<\/tr>\n
\n

1st Place:<\/strong><\/p>\n

\"\"<\/p>\n

Gil Garteiz<\/p>\n

Tower Semiconductor, Israel<\/p>\n

A 22 angstrom low-voltage gate ruptured by ESD testing is exposed from the backside by removing the substrate. The final wet etch step has etched the gate poly out from behind the rupture oxide. Layers shown: STI, silicided active & contacts, spacers, gate oxide<\/td>\n

\n
\n

2nd Place:<\/strong>\u00a0<\/strong><\/p>\n

\"\"<\/p>\n

Frank Zhenge<\/p>\n

Semiconductor Insights, Ontario, Canada<\/p>\n

SRAM cross section\n<\/p><\/div>\n<\/td>\n<\/tr>\n

\n

3rd Place:<\/strong><\/p>\n

\"\"<\/p>\n

Sue Li Poh<\/p>\n

Micron Semiconductor, Asia<\/p>\n

Contamination at Contact Plugs<\/td>\n

\n
<\/div>\n
<\/div>\n
<\/div>\n<\/td>\n<\/tr>\n
<\/a>\u00a0<\/strong>Category III: False Color Images<\/strong><\/td>\n<\/tr>\n
\n

1st Place:<\/strong><\/p>\n

\"\"<\/p>\n

Robert Ulfig<\/p>\n

Imago Scientific Instruments, Wisconsin, USA<\/p>\n

3D Atom Probe Analysis of CVD Deposited Silicon Germanium, Boron Doped Silicon and Boron Doped Silicon Germanium films. Each dot or sphere indicated the location of individual atoms in the films. Silicon(Grey), Germanium(Green), and Boron(Blue Spheres). Only a fraction of the atoms are displayed for clarity.<\/p>\n

\n<\/td>\n

\n
\n

2nd Place:<\/strong><\/p>\n

\"\"\n<\/p>\n

Kartik Ramanujachar<\/p>\n

Texas Instruments, Texas, USA<\/p>\n

Scanning current image of a SRAM showing
\ngate contact leakage that caused a single bit failure.
\nThe leaky gate contact appears like an extra
\ncontact juxtaposed between four other contacts.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n

\n

3rd Place:<\/strong><\/p>\n

\"\"<\/p>\n

Bernhard Tittmann<\/p>\n

Pennsylvania State University, USA<\/p>\n

Image obtained with Ultrasonic Atomic Force Microscope which images relative modulus changes. The sample is a “green body” of Alumina particles (orange-white) with 3% binder (dark circles) The binder (Acrylic Emulsion) shows up as dark, because it has a lower modulus than the Alumina. The image is 10×10 micron. The particle size is about 1 micron. The binder could not be distinguished from the Alumina by any other microscope available.<\/td>\n

\n
<\/div>\n
<\/div>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

2005 Photo Contest Winners Congratulations to the 2005 winners! \u00a0Category I: Color Images 1st Place: Andrew Woodard Semiconductor Insights, Ontario, Canada Light diffracting off decapped microcontroller 2nd Place: Wong Yaw Yuan Micron Semiconductor, Asia Leaf pattern with bubble like void observed on the die attached tape after delamination occur due to insufficient cure of polyimide…. View Article<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"parent":0,"menu_order":99,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-135","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"\n2005 - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/103-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"2005 - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"2005 Photo Contest Winners Congratulations to the 2005 winners! \u00a0Category I: Color Images 1st Place: Andrew Woodard Semiconductor Insights, Ontario, Canada Light diffracting off decapped microcontroller 2nd Place: Wong Yaw Yuan Micron Semiconductor, Asia Leaf pattern with bubble like void observed on the die attached tape after delamination occur due to insufficient cure of polyimide.... 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