{"id":136,"date":"2014-06-04T15:28:08","date_gmt":"2014-06-04T15:28:08","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/2018_photo\/104-2\/"},"modified":"2022-11-23T06:36:23","modified_gmt":"2022-11-23T06:36:23","slug":"104-2","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/104-2\/","title":{"rendered":"2004"},"content":{"rendered":"

2004 Photo Contest Winners<\/h1>\n\n\n\n\n\n\n\n\n\n\n\n\n
Congratulations to the 2004 winners!<\/strong><\/td>\n<\/tr>\n
<\/a>\u00a0Category I: Color Images<\/strong><\/td>\n<\/tr>\n
1st Place:<\/strong><\/p>\n

\"\"<\/p>\n

Steve Elwell
\nFreescale, Arizona<\/p>\n

Incoming! This RF device suffered severe electrical overstress at the metal drain finger, resulting in this 3 dimensional “explosion” effect! Has this event ended, or is it still ongoing?<\/p>\n

\n<\/td>\n

\n
\n

2nd Place:<\/strong><\/p>\n

\"\"
\nMark Lam Tiam Weng<\/p>\n

Institute of Microelectronics, Singapore
\nParticle on top of wafer with Low K
\nDielectric Film. The Flame like
\ndefect looks like the chinese character
\n“Huo” for fire.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n

3rd Place:\u00a0<\/strong><\/p>\n

\"\"<\/p>\n

Ray Haythornthwaite<\/p>\n

Semiconductor Insights, Canada
\nImage of an “exploding” failed Light Emitting Diode (LED).<\/td>\n

\n

\n<\/td>\n<\/tr>\n

<\/a>\u00a0<\/strong>Category II: Black and White Images<\/strong><\/td>\n<\/tr>\n
\n

1st Place:<\/strong><\/p>\n

\"\"<\/p>\n

Murali Hanabe, Sesil Mathew, and Sridhar Canumalla<\/p>\n

Nokia, Texas
\nA SnAgCu solder ball in a chip scale package (CSP) was etched away to reveal non-wetted areas on the Cu pad on the CSP. The picture shows the growth of Ag3Sn intermetallic phase with dendritic morphology from the Cu6Sn5 scallop-shaped intermetallic phase on the Cu pad. The Cu6Sn5 intermetallic also forms hexagonal, rod-shaped crystals. The non-wetted areas were contributing to early failure by acting as crack initiation sites.<\/td>\n

\n
\n

2nd Place:<\/strong>\u00a0<\/strong><\/p>\n

\"\"<\/p>\n

Jay Kopycinski<\/p>\n

Freescale, Arizona<\/p>\n

SEM image of ESD induced overstress
\ndamage at gate poly of MOS transistor.
\nFused polysilicon can be seen stretching
\nfrom the gate poly (left) to the source
\ncontact area.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n

\n

3rd Place:<\/strong><\/p>\n

\"\"<\/p>\n

Brett Engel and John Petrus<\/p>\n

IBM, New York<\/p>\n

3-Dimentional SEM image depicting thermal cycle induced shear in an isolated stacked via structure in copper interconnect<\/td>\n

\n
<\/div>\n
<\/div>\n
<\/div>\n<\/td>\n<\/tr>\n
<\/a>\u00a0<\/strong>Category III: False Color Images<\/strong><\/td>\n<\/tr>\n
\n

1st Place:<\/strong><\/p>\n

\"\"<\/p>\n

Carl Wintgens and Michael Phaneuf<\/p>\n

Wintgens – Semiconductor Insights, Canada
\nPhaneuf – Fibics, Canada<\/p>\n

EFTEM color image of a cross-section through an Al metal line and W “plug” contact. In this image, Si is blue, Ti is red, and TiN is yellow. A Si-rich nodule is visible, as well as a potential failure site in the TiN barrier that could result in “volcano” formation.<\/p>\n

\n<\/td>\n

\n
\n

2nd Place:<\/strong><\/p>\n

\"\"\n<\/p>\n

Olivier Crepel, Solomon Woods and Lee Knauss<\/p>\n

Crepel – Philips, France<\/p>\n

Woods and Knauss – Neocera, Maryland<\/p>\n

Magnetic field distribution of an
\nRF Inductor measured with a
\nmagnetoresistive sensor.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n

\n

3rd Place:<\/strong><\/p>\n

\"\"<\/p>\n

Otwin Breitenstein<\/p>\n

Max Planck Institute of Microstructure Physics, Germany<\/p>\n

Lock-in thermogram of an integrated circuit after ESD stressing (T-modulation amplitude image, Tmax = 10 mK). The bright spots are sites of leakage currents, the weakest ones dissipating about 100 microwatts.<\/td>\n

\n
<\/div>\n
<\/div>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

2004 Photo Contest Winners Congratulations to the 2004 winners! \u00a0Category I: Color Images 1st Place: Steve Elwell Freescale, Arizona Incoming! This RF device suffered severe electrical overstress at the metal drain finger, resulting in this 3 dimensional “explosion” effect! Has this event ended, or is it still ongoing? 2nd Place: Mark Lam Tiam Weng Institute… View Article<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"parent":0,"menu_order":111,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-136","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"\n2004 - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/104-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"2004 - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"2004 Photo Contest Winners Congratulations to the 2004 winners! \u00a0Category I: Color Images 1st Place: Steve Elwell Freescale, Arizona Incoming! This RF device suffered severe electrical overstress at the metal drain finger, resulting in this 3 dimensional “explosion” effect! Has this event ended, or is it still ongoing? 2nd Place: Mark Lam Tiam Weng Institute... View Article\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/104-2\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:modified_time\" content=\"2022-11-23T06:36:23+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/104-2\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/104-2\\\/\",\"name\":\"2004 - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2014-06-04T15:28:08+00:00\",\"dateModified\":\"2022-11-23T06:36:23+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/104-2\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/104-2\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/104-2\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"2004\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"2004 - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/104-2\/","og_locale":"en_US","og_type":"article","og_title":"2004 - Electronic Device Failure Analysis Society","og_description":"2004 Photo Contest Winners Congratulations to the 2004 winners! \u00a0Category I: Color Images 1st Place: Steve Elwell Freescale, Arizona Incoming! This RF device suffered severe electrical overstress at the metal drain finger, resulting in this 3 dimensional “explosion” effect! Has this event ended, or is it still ongoing? 2nd Place: Mark Lam Tiam Weng Institute... View Article","og_url":"https:\/\/www.asminternational.org\/edfas\/104-2\/","og_site_name":"Electronic Device Failure Analysis Society","article_modified_time":"2022-11-23T06:36:23+00:00","twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/104-2\/","url":"https:\/\/www.asminternational.org\/edfas\/104-2\/","name":"2004 - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2014-06-04T15:28:08+00:00","dateModified":"2022-11-23T06:36:23+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/104-2\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/104-2\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/104-2\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"2004"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/136","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=136"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/136\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=136"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}