{"id":138,"date":"2014-06-04T15:29:08","date_gmt":"2014-06-04T15:29:08","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/2018_photo\/106-2\/"},"modified":"2022-11-23T06:36:36","modified_gmt":"2022-11-23T06:36:36","slug":"106-2","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/106-2\/","title":{"rendered":"2002"},"content":{"rendered":"

2002 Photo Contest Winners<\/h1>\n\n\n\n\n\n\n\n\n\n\n\n\n
Congratulations to the 2002 winners!<\/strong><\/td>\n<\/tr>\n
<\/a>\u00a0Category I: Color Images<\/strong><\/td>\n<\/tr>\n
1st Place:<\/strong><\/p>\n

\"\"<\/p>\n

Mark Kearns<\/p>\n

LG Electronics
\nSubmission Category: Optical Microscopy, Color<\/p>\n

The multicolored bond pads in this photo were the result of sputter-coating the device with a thin layer of gold\/palladium in preparation for SEM analysis. Appropriately, this integrated circuit handles all of the colors of the spectrum because it is a triple video output driver for a color television picture tube.<\/p>\n

\n<\/td>\n

\n
\n

2nd Place:<\/strong><\/p>\n

\"\"
\nAng Chong Yong<\/p>\n

Agilent Technologies (Malaysia) Sdn. Bhd.<\/p>\n

“Sea anemone”. An IC surface contaminated with
\norganic contaminant. This contaminant originates
\nfrom the black glob top material, spreading
\nacross the surface.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n

3rd Place:\u00a0<\/strong><\/p>\n

\"\"<\/p>\n

Varaporn Suwanmethanond<\/p>\n

Gemfire Corporation<\/p>\n

Category: I Optical Microscopy<\/p>\n

Bond pads lifted during wire bonding process. The image revealed the poor adhesion layer between the active material substrate and the gold pad.<\/p>\n<\/td>\n

\n

\n<\/td>\n<\/tr>\n

<\/a>\u00a0<\/strong>Category II: Black and White Images<\/strong><\/td>\n<\/tr>\n
1st Place:<\/strong><\/p>\n

\"\"<\/p>\n

Teresa Gutierrez<\/p>\n

Sandia National Laboratories<\/p>\n

Dual FIB cross-sections along the pin joint of a worn microgear. The left cross-section was cut along the axis of strongest force and shows more wear and debris accumulation. The right cross-section was cut along the axis of weakest force and reveals minimal wear.<\/td>\n

\n
\n

2nd Place:<\/strong>\u00a0<\/strong><\/p>\n

\"\"<\/p>\n

Aprem Benjamin<\/p>\n

FeinFocus USA, Inc.<\/p>\n

X-ray image of a rose taken with a FeinFocus
\nFOX-160.25 Nanofocus X-ray System with
\nhalf a micron resolution.<\/p>\n

 <\/p>\n<\/div>\n<\/td>\n<\/tr>\n

3rd Place:<\/strong><\/p>\n

\"\"<\/p>\n

Hui Hui Kim<\/p>\n

Singapore Science Park II<\/p>\n

Submission Category: SEM micrograph<\/p>\n

8 Layer Metal Interconnect Structure of Cu Dual Damascene Process – DSIC\/FAR, Institute of Microelectronics<\/td>\n

\n
<\/div>\n
<\/div>\n
<\/div>\n<\/td>\n<\/tr>\n
<\/a>\u00a0<\/strong>Category III: False Color Images<\/strong><\/td>\n<\/tr>\n
1st Place:<\/strong><\/p>\n

\"\"<\/p>\n

\n

Philip Strudwick<\/p>\n

ERA Technology Ltd<\/p>\n

Growth of copper-rich “teeth” through solder from copper header (red) to Transient Voltage Suppressor diode chip (blue) with particles of high silver content (green) moving in the opposite direction and the nickel barrier layer (purple) severely disrupted.<\/td>\n

\n
\n

2nd Place:<\/strong><\/p>\n

\"\"
\nPetar Ratchev<\/p>\n

IMEC<\/p>\n

First OIM map of a Cu to Cu wire bond cross-section.
\nHigh angle boundaries(>15\u00b0) separate grains.
\nDifferent colors represent different orientations in
\nrespect to bond pad normal: blue in, red in and green in.<\/p>\n

\n<\/div>\n<\/td>\n<\/tr>\n

3rd Place:<\/strong><\/p>\n

\"\"<\/p>\n

James Shearer, William Orso<\/p>\n

Matrix Semiconductor<\/p>\n

SEM cross-sectional view of MatrixTM 3-D Memory. Eight write-once memory layers are stacked vertically. Bitlines are shown in blue, wordlines are shown in green. Image concept by S. Sivaram. X-section and etch by AMER labs. SEM by J Shearer. False colorization by W Orso.\u00a9 Matrix Semiconductor, 2002<\/td>\n

\n
<\/div>\n
<\/div>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

2002 Photo Contest Winners Congratulations to the 2002 winners! \u00a0Category I: Color Images 1st Place: Mark Kearns LG Electronics Submission Category: Optical Microscopy, Color The multicolored bond pads in this photo were the result of sputter-coating the device with a thin layer of gold\/palladium in preparation for SEM analysis. Appropriately, this integrated circuit handles all… View Article<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"parent":0,"menu_order":333,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-138","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"\n2002 - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/106-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"2002 - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"2002 Photo Contest Winners Congratulations to the 2002 winners! \u00a0Category I: Color Images 1st Place: Mark Kearns LG Electronics Submission Category: Optical Microscopy, Color The multicolored bond pads in this photo were the result of sputter-coating the device with a thin layer of gold\/palladium in preparation for SEM analysis. Appropriately, this integrated circuit handles all... 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