{"id":139,"date":"2014-06-04T15:29:31","date_gmt":"2014-06-04T15:29:31","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/2018_photo\/107-2\/"},"modified":"2022-11-23T06:36:45","modified_gmt":"2022-11-23T06:36:45","slug":"107-2","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/107-2\/","title":{"rendered":"2001"},"content":{"rendered":"<h1>2001 Photo Contest Winners<\/h1>\n<table border=\"1\" width=\"700\" cellspacing=\"0\" cellpadding=\"1\">\n<tbody>\n<tr>\n<td class=\"title\" style=\"width: 598px;\" colspan=\"2\" height=\"61\"><strong>Congratulations to the 2001 winners!<\/strong><\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td style=\"width: 598px;\" colspan=\"2\" height=\"20\"><a id=\"color\" name=\"color\"><\/a>\u00a0<strong>Category I: Color Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td class=\"place_text\" style=\"width: 211px;\" valign=\"top\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 201px; height: 141px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/color_1.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Jianxiong Chen<\/p>\n<p>Nokia Corporation, Finland<\/p>\n<p>The photo is not of a pine tree on a winter&#8217;s night. It is a silver dendrite growth found in a hybrid in telecom equipment that was used in the field for just 3-5 months. The photo was taken using optical microscopy with 500x magnification.<\/p>\n<p style=\"text-align: center;\">\n<\/td>\n<td class=\"lessontitle\" style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 201px; height: 149px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/color_2.jpg\" alt=\"\" \/><br \/>\nMark Kearns<\/p>\n<p>Zenith Electronics Corporation, Illinois<\/p>\n<p>Subtle ESD damage to IC protection structure, as<br \/>\ndetected by liquid crystal analysis. The failure site is<br \/>\nthe dark circular spot to the lower left of the ball<br \/>\nbond, at the corner of the bond pad.\n<\/p><\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\"><strong>3rd Place:\u00a0<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 201px; height: 151px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/color_3.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Walter M. Smith<\/p>\n<p>L-3 Communication Systems, New Jersey<\/p>\n<p>Plastic package bulging at the seams !<br \/>\nThis was caused by absorbed moisture which vaporized during the heat of convection reflow soldering.<\/td>\n<td style=\"width: 387px;\">\n<p align=\"center\">\n<\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td style=\"width: 598px;\" colspan=\"2\"><a id=\"bw\" name=\"bw\"><\/a><strong>\u00a0<\/strong><strong>Category II: Black and White Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 201px; height: 153px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/bw_1.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">James Riddle<\/p>\n<p>Oceanside, California<\/p>\n<p>Intermittent triggering of magnetic field intrusion detector determined to be caused by conductive paths across insulators. SEM revealed salt accumulation in the insulators and bridging across insulator by spider webs. This is a photograph of a sodium chloride crystal grown on a single spider web filament.<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><strong>\u00a0<\/strong><\/p>\n<p><img decoding=\"async\" style=\"width: 201px; height: 137px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/bw_2.jpg\" alt=\"\" \/><\/p>\n<p>Erkko Elonen<\/p>\n<p>Nokia Mobile Phones, Finland<\/p>\n<p>Lead migration in SnPb pattern. A bias voltage was<br \/>\napplied between two solder patterns in order<br \/>\nto study surface insulation resistance during<br \/>\nmoisture testing.\n<\/p><\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\"><strong>3rd Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 201px; height: 161px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/bw_3.gif\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Bernhard Knoll<\/p>\n<p>Infineon Technologies AG, Germany<\/p>\n<p>\u2018Silicon Canyon&#8217; &#8211; The SEM image shows erosion on micron scale. The structures were formed during focused ion beam preparation of a lamella (not shown) for transmission electron microscopy. Dirt from the previous polishing step served as a mask thus preventing FIB etching in an artistic manner.<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<\/td>\n<\/tr>\n<tr bgcolor=\"#d09800\">\n<td class=\"blue_borderbottom\" style=\"width: 598px;\" colspan=\"2\"><a id=\"false\" name=\"false\"><\/a><strong>\u00a0<\/strong><strong>Category III: False Color Images<\/strong><\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\"><strong>1st Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 201px; height: 203px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/fc_1.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Dave Vallett<\/p>\n<p>St. Essex Junction, Vermont<\/p>\n<p>Backside current density image of an SRAM device obtained with a scanning SQUID (superconducting quantum interference device) microscope. A Fourier image transform converts the mapped magnetic fields into current density. A surface plot is then created using commercial image processing software.<\/p>\n<p style=\"text-align: center;\">\n<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\">\n<p><strong>2nd Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 201px; height: 201px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/fc_2.jpg\" alt=\"\" \/>\n<\/p>\n<p style=\"text-align: center;\">Kartik Ramanujachar<\/p>\n<p>Texas Instruments Incorporated, Texas<\/p>\n<p style=\"text-align: center;\">\nScanning capacitance image (SCM) of<br \/>\nsubstrate level defect seen in a capacitor<br \/>\nstructure.The defect is enclosed within<br \/>\nthe blue box. Wafer was processed to the<br \/>\nlevel of gate oxide.<\/p>\n<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td style=\"width: 211px;\" valign=\"top\"><strong>3rd Place:<\/strong><\/p>\n<p style=\"text-align: center;\"><img decoding=\"async\" style=\"width: 201px; height: 179px;\" src=\"\/app\/uploads\/sites\/41\/files\/17848646\/fc_3.jpg\" alt=\"\" \/><\/p>\n<p style=\"text-align: center;\">Bernd Ebersberger<\/p>\n<p>Infineon Technologies, Germany<\/p>\n<p>Atomic Force Microscopy image of a tungsten via-plug embedded in intermetal oxide after tungsten-CMP and subsequent oxide-CMP. AFM measures the flatness of the surface: the step height between the different materials, surface roughness and how deeply the tungsten is dished out in the plug and the surrounding oxide.<\/td>\n<td style=\"width: 387px;\">\n<div align=\"center\"><\/div>\n<div align=\"center\"><\/div>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>2001 Photo Contest Winners Congratulations to the 2001 winners! \u00a0Category I: Color Images 1st Place: Jianxiong Chen Nokia Corporation, Finland The photo is not of a pine tree on a winter&#8217;s night. It is a silver dendrite growth found in a hybrid in telecom equipment that was used in the field for just 3-5 months&#8230;. <a class=\"view-article\" href=\"https:\/\/www.asminternational.org\/edfas\/107-2\/\">View Article<\/a><\/p>\n","protected":false},"author":3,"featured_media":0,"parent":0,"menu_order":444,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-139","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>2001 - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/107-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"2001 - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"2001 Photo Contest Winners Congratulations to the 2001 winners! \u00a0Category I: Color Images 1st Place: Jianxiong Chen Nokia Corporation, Finland The photo is not of a pine tree on a winter&#8217;s night. 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