{"id":7230,"date":"2023-10-02T17:17:44","date_gmt":"2023-10-02T17:17:44","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/?page_id=7230"},"modified":"2026-10-04T21:22:13","modified_gmt":"2026-10-04T21:22:13","slug":"fa-technology-roadmap-committee","status":"publish","type":"page","link":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/","title":{"rendered":"International Roadmap for Failure Analysis"},"content":{"rendered":"\t\t
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\"\"The purpose of the International Roadmap for Failure Analysis is to leverage the technical expertise captured throughout the industry to identify both current and future FA challenges as part of an annual industry-wide gap analysis. To have this effort formalized and available across the industry in an interactive and inclusive manner will not only return a critical compilation of relevant action items it will also serve as a recognized technical platform from which future failure analysts will benefit. In addition, its purpose is to serve as a technical platform from which everyone connected to the industry can learn, interact, and prepare for the future.<\/p>

Vision<\/h3>

To be the leading international authority in electronic device failure analysis for proactively identifying the evolving technology challenges and gaps and influencing potential solutions to advance semiconductor industry.<\/p>

Mission<\/h3>

1. Identify key gaps, challenges, and technological needs for the FA of both current and next-generation electronic devices.<\/p>

2. Influence industry, scientific equipment manufacturers, research institutes, and universities to co-develop innovative solutions and strategies for the identified gaps.<\/p>

3. Elevate global FA awareness by participating in conferences, workshops, and collaborative forums, share knowledge, and foster dialogue within the broader semiconductor community.<\/p>

4. Advocate strategic investments in FA R&D and actively influence global policy and funding initiatives to strengthen semiconductor developments.<\/p>

5. Deliver actionable roadmaps that guide FA stakeholders in building robust capabilities and addressing future challenges.<\/p>

Deliverables<\/h3>
  1. FA Roadmap Gaps Technical Report (Published 2022, Major Revision 2027)<\/li>
  2. IRFA Solutions to Gaps Report (2025)<\/li>
  3. Strategic Engagements with wider international roadmap bodies<\/li>
  4. IRFA sessions at Conferences & Workshops including ISTFA, IPFA, CAM, NIST, Relevant Design\/Process\/Packaging conferences<\/li><\/ol>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t
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    IRFA Leadership<\/h1>

    \"\"<\/p>

    General Chair
    Vinod Narang
    AMD<\/p><\/td>

    \"\"<\/p>

    Co-General Chair
    Dr. Felix Beaudoin FASM
    Globalfoundries
    <\/strong><\/p><\/td><\/tr>

    \"\"<\/p>

    Keith Serrels
    Hamamatsu<\/p><\/td>

    \"\"<\/p>

    Dr. David Su
    Consultant<\/p><\/td><\/tr>

    \"\"<\/p>

    Ryan Ross
    Intel<\/p><\/td>

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    Roadmap ISTFA Chairs<\/h2>

    \"\"<\/p>

    Lesly Endrinal
    Qualcomm<\/p><\/td>

    \"\"<\/p>

    Keith Serrels
    Hamamatsu<\/p><\/td><\/tr><\/tbody><\/table>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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    \n\t\t\t\t\t\n\t\t\t\t\t\t\n\t\t\t\t\t\t\t\t\tView FA Roadmap Technical Book<\/span>\n\t\t\t\t\t<\/span>\n\t\t\t\t\t<\/a>\n\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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    How to Get Involved:<\/h3>\nTo learn more or to volunteer for the FA Technical Roadmap Committee, contact Nicole Hale at nicole.hale@asminternational.org.\n\n
    \t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>\n\t\t","protected":false},"excerpt":{"rendered":"

    The purpose of the International Roadmap for Failure Analysis is to leverage the technical expertise captured throughout the industry to identify both current and future FA challenges as part of an annual industry-wide gap analysis. To have this effort formalized and available across the industry in an interactive and inclusive manner will not only return… View Article<\/a><\/p>\n","protected":false},"author":63087,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"page-full.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-7230","page","type-page","status-publish","hentry"],"bricks_content":"","yoast_head":"\nInternational Roadmap for Failure Analysis - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"International Roadmap for Failure Analysis - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"The purpose of the International Roadmap for Failure Analysis is to leverage the technical expertise captured throughout the industry to identify both current and future FA challenges as part of an annual industry-wide gap analysis. To have this effort formalized and available across the industry in an interactive and inclusive manner will not only return... 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Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/fa-technology-roadmap-committee\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/fa-technology-roadmap-committee\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/app\\\/uploads\\\/sites\\\/41\\\/2026\\\/09\\\/Roadmap-Color-600px.avif\",\"datePublished\":\"2023-10-02T17:17:44+00:00\",\"dateModified\":\"2026-10-04T21:22:13+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/fa-technology-roadmap-committee\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/fa-technology-roadmap-committee\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/fa-technology-roadmap-committee\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/app\\\/uploads\\\/sites\\\/41\\\/2026\\\/09\\\/Roadmap-Color-600px.avif\",\"contentUrl\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/app\\\/uploads\\\/sites\\\/41\\\/2026\\\/09\\\/Roadmap-Color-600px.avif\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/fa-technology-roadmap-committee\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"International Roadmap for Failure Analysis\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"International Roadmap for Failure Analysis - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/","og_locale":"en_US","og_type":"article","og_title":"International Roadmap for Failure Analysis - Electronic Device Failure Analysis Society","og_description":"The purpose of the International Roadmap for Failure Analysis is to leverage the technical expertise captured throughout the industry to identify both current and future FA challenges as part of an annual industry-wide gap analysis. To have this effort formalized and available across the industry in an interactive and inclusive manner will not only return... View Article","og_url":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/","og_site_name":"Electronic Device Failure Analysis Society","article_modified_time":"2026-10-04T21:22:13+00:00","og_image":[{"url":"https:\/\/www.asminternational.org\/edfas\/app\/uploads\/sites\/41\/2026\/09\/Roadmap-Color-600px.avif","type":"","width":"","height":""}],"twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"4 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/","url":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/","name":"International Roadmap for Failure Analysis - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/#primaryimage"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/#primaryimage"},"thumbnailUrl":"https:\/\/www.asminternational.org\/edfas\/app\/uploads\/sites\/41\/2026\/09\/Roadmap-Color-600px.avif","datePublished":"2023-10-02T17:17:44+00:00","dateModified":"2026-10-04T21:22:13+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/#primaryimage","url":"https:\/\/www.asminternational.org\/edfas\/app\/uploads\/sites\/41\/2026\/09\/Roadmap-Color-600px.avif","contentUrl":"https:\/\/www.asminternational.org\/edfas\/app\/uploads\/sites\/41\/2026\/09\/Roadmap-Color-600px.avif"},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/fa-technology-roadmap-committee\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"International Roadmap for Failure Analysis"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/7230","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63087"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=7230"}],"version-history":[{"count":10,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/7230\/revisions"}],"predecessor-version":[{"id":9629,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/pages\/7230\/revisions\/9629"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=7230"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}