{"id":3112,"date":"2023-01-19T13:00:12","date_gmt":"2023-01-19T07:30:12","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/chipletz-selects-siemens-eda-solutions-for-its-smart-substrate-ic-packaging-technology\/"},"modified":"2023-01-19T13:00:12","modified_gmt":"2023-01-19T07:30:12","slug":"chipletz-selects-siemens-eda-solutions-for-its-smart-substrate-ic-packaging-technology","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/51285181\/NEWS\/","title":{"rendered":"Chipletz selects Siemens\u2019 EDA solutions for its smart substrate IC packaging technology"},"content":{"rendered":"

\"\"Siemens Digital Industries Software, Plano, Texas, announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic design automation (EDA) provider for the development of its groundbreaking Smart Substrate products.<\/p>\n

After an extensive technical evaluation of available solutions, Chipletz selected a suite of Siemens\u2019 industry-leading EDA tools for the design and verification of its Smart Substrate technology, which facilitates the heterogeneous integration of multiple ICs in a single package for critical artificial intelligence workloads, immersive consumer experiences, and high-performance computing.<\/p>\n

\u201cThe Chipletz vision is to revolutionize semiconductor in-package functionality through the development of advanced packaging technology that bridges the gap between the slowing of Moore’s Law and the rising demand for compute performance,\u201d said Bryan Black, chief executive officer of Chipletz. \u201cOur Smart Substrate designs, now in development, are very demanding. Siemens has demonstrated that they have the ideal technology for our needs.\u201d<\/p>\n

To design and verify the heterogeneous integration of multiple ICs into a Smart Substrate based package, Chipletz selected Siemens\u2019 Xpedition Substrate Integrator software, Xpedition Package Designer software, Hyperlynx software and Calibre 3DSTACK software solutions.<\/p>\n

\u201cSiemens is honored to be selected by Chipletz as a primary semiconductor packaging design and verification supplier,\u201d said AJ Incorvaia, senior vice president of Electronic Board Systems at Siemens Digital Industries Software. \u201cThe Chipletz Smart Substrate technology offers Chipletz customers a robust path to bring multiple ICs, even from different vendors, into a wide range of system-in-package configurations using Siemens\u2019 design tools to deliver a high-performing and cost-effective end-product.\u201d<\/p>\n

 <\/p>\n

For more information:<\/p>\n

Chipletz<\/p>\n

https:\/\/chipletz.com\/<\/a><\/p>\n

 <\/p>\n

Siemens Digital Industries Software<\/p>\n

https:\/\/www.sw.siemens.com\/en-US\/<\/a><\/p>\n

 <\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Siemens Digital Industries Software, Plano, Texas, announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic design automation (EDA) provider for the development of its groundbreaking Smart Substrate products. After an extensive technical evaluation of available solutions, Chipletz selected a suite of Siemens\u2019 industry-leading EDA tools for the design and… View Article<\/a><\/p>\n","protected":false},"author":63080,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,444,435,436,1],"tags":[],"class_list":["post-3112","post","type-post","status-publish","format-standard","hentry","category-electronics","category-industries-and-applications","category-news","category-news-articles","category-uncategorized"],"yoast_head":"\nChipletz selects Siemens\u2019 EDA solutions for its smart substrate IC packaging technology - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/51285181\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Chipletz selects Siemens\u2019 EDA solutions for its smart substrate IC packaging technology - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Siemens Digital Industries Software, Plano, Texas, announced that Chipletz, an innovative fabless substrate startup, has selected Siemens as its strategic electronic design automation (EDA) provider for the development of its groundbreaking Smart Substrate products. 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