{"id":3805,"date":"2019-09-18T12:50:52","date_gmt":"2019-09-18T12:50:52","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/"},"modified":"2023-02-07T04:52:39","modified_gmt":"2023-02-07T04:52:39","slug":"imec-develops-improved-test-vehicle-for-localization-of-dielectric-breakdown-sites","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/","title":{"rendered":"Imec develops improved test vehicle for localization of dielectric breakdown sites"},"content":{"rendered":"<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\">Imec, Belgium, has developed a dual-damascene 21nm-pitch test vehicle relevant for manufacturing the 3nm logic technology node. With this test vehicle, a 30 percent improvement in resistance-capacitance product (RC) was obtained compared to previous generations, without impacting reliability. The need for implementing scaling boosters such as self-aligned vias and self-aligned blocks in 3nm and beyond interconnect technologies has been demonstrated.<\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\">While the dimensional scaling of traditional front-end technologies is expected to slow down, the back-end-of-line dimensions keep on scaling with ~0.7X to keep up with the required area scaling. For the 3nm logic technology node, M2 interconnect layers with metal pitches as tight as 21nm need to be manufactured while preserving the back-end-of-line\u2019s performance. This implies a tight control of the RC delay, while maintaining good reliability.<\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\">The test vehicle also performs well in terms of reliability: no electromigration failures were observed after 530 hours at 330\u00b0C, and dielectric breakdown (TDDB) measurements demonstrated a time-to-failure &gt;10 years at 100\u00b0C.<\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\">To pattern the M2 layer, a hybrid lithography approach was proposed, using 193nm immersion-based self-aligned quadrupole patterning (SAQP) for printing the lines and trenches, and extreme ultraviolet lithography (EUVL) for printing the block and via structures. The test vehicle implemented a barrier-less ruthenium (Ru) metallization scheme and an insulator with dielectric constant k = 3.0.<\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\">First results also demonstrate that the proposed interconnect technology can be improved by adding scaling boosters, including buried power rail, SuperVia, self-aligned blocks, fully self-aligned vias and double self-aligned blocks.<\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\"><a href=\"https:\/\/www.imec-int.com\/en\/advanced-nano-interconnects\" target=\"blank\" rel=\"noopener\">https:\/\/www.imec-int.com\/en\/advanced-nano-interconnects<\/a> <\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Imec, Belgium, has developed a dual-damascene 21nm-pitch test vehicle relevant for manufacturing the 3nm logic technology node.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,438,435,436,1],"tags":[],"class_list":["post-3805","post","type-post","status-publish","format-standard","hentry","category-electronics","category-nanotechnology","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Imec develops improved test vehicle for localization of dielectric breakdown sites - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Imec develops improved test vehicle for localization of dielectric breakdown sites - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Imec, Belgium, has developed a dual-damascene 21nm-pitch test vehicle relevant for manufacturing the 3nm logic technology node.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2019-09-18T12:50:52+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-07T04:52:39+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/38331591\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/38331591\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"Imec develops improved test vehicle for localization of dielectric breakdown sites\",\"datePublished\":\"2019-09-18T12:50:52+00:00\",\"dateModified\":\"2023-02-07T04:52:39+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/38331591\\\/NEWS\\\/\"},\"wordCount\":264,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Electronics\",\"Nanotechnology\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/38331591\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/38331591\\\/NEWS\\\/\",\"name\":\"Imec develops improved test vehicle for localization of dielectric breakdown sites - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2019-09-18T12:50:52+00:00\",\"dateModified\":\"2023-02-07T04:52:39+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/38331591\\\/NEWS\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/38331591\\\/NEWS\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/38331591\\\/NEWS\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Imec develops improved test vehicle for localization of dielectric breakdown sites\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Imec develops improved test vehicle for localization of dielectric breakdown sites - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"Imec develops improved test vehicle for localization of dielectric breakdown sites - Electronic Device Failure Analysis Society","og_description":"Imec, Belgium, has developed a dual-damascene 21nm-pitch test vehicle relevant for manufacturing the 3nm logic technology node.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2019-09-18T12:50:52+00:00","article_modified_time":"2023-02-07T04:52:39+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/"},"author":{"name":"","@id":""},"headline":"Imec develops improved test vehicle for localization of dielectric breakdown sites","datePublished":"2019-09-18T12:50:52+00:00","dateModified":"2023-02-07T04:52:39+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/"},"wordCount":264,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Electronics","Nanotechnology","news","News Articles"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/","name":"Imec develops improved test vehicle for localization of dielectric breakdown sites - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2019-09-18T12:50:52+00:00","dateModified":"2023-02-07T04:52:39+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/38331591\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"Imec develops improved test vehicle for localization of dielectric breakdown sites"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/3805","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63082"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=3805"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/3805\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=3805"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=3805"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=3805"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}