{"id":3845,"date":"2019-05-17T15:21:15","date_gmt":"2019-05-17T15:21:15","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/"},"modified":"2023-02-07T04:52:42","modified_gmt":"2023-02-07T04:52:42","slug":"skywater-selects-veecos-waferstorm-for-3d-monolithic-system-on-a-chip-development","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/","title":{"rendered":"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development"},"content":{"rendered":"

Veeco Instruments Inc., Plainview, N.Y., announces that SkyWater Technology Foundry has taken delivery of the WaferStorm single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology. <\/span><\/span><\/p>\n

 <\/p>\n

The most advanced U.S.-based and solely U.S.-owned Technology Foundry, SkyWater is leveraging the process performance and production capabilities of WaferStorm to create densely integrated logic and memory products. Using breakthrough 3DSoC technology, SkyWater is collaborating with researchers at the Massachusetts Institute of Technology to set a new threshold for device performance and energy efficiency.<\/span><\/span><\/p>\n

 <\/p>\n

\u201cOur selection of the WaferStorm system was based on Veeco\u2019s reputation of delivering best-in-class technology for wet processing that enables many leading-edge applications,\u201d stated Gregg Damminga, Vice President of Technology Development, SkyWater. \u201cThe solvent-based platform offers a precise level of control during wafer processing which is essential to the innovations we are working on with MIT to develop technology that drives better performing devices at lower cost.\u201d<\/span><\/span><\/p>\n

 <\/p>\n

WaferStorm\u2019s unique ImmJET solvent technology provides customers with the best overall process performance, flexibility, and production capability in its class compared to conventional batch or spray-only approaches. It offers proven, reliable solutions for metal lift-off (MLO), photoresist strip, dry film resist strip, via cleans, flux removal, and other advanced packaging processes. It is also the production tool of record for MLO at several leading vertical-cavity surface-emitting laser (VCSEL) manufacturers today.<\/span><\/span><\/p>\n

 <\/p>\n

www.veeco.com<\/a><\/span> <\/span><\/p>\n

 <\/p>\n

www.skywatertechnology.com<\/a><\/span> <\/span><\/p>\n

 <\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Veeco Instruments Inc., Plainview, N.Y., announces that SkyWater Technology Foundry has taken delivery of the WaferStorm single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,435,436,1],"tags":[],"class_list":["post-3845","post","type-post","status-publish","format-standard","hentry","category-electronics","category-news","category-news-articles","category-uncategorized"],"yoast_head":"\nSkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Veeco Instruments Inc., Plainview, N.Y., announces that SkyWater Technology Foundry has taken delivery of the WaferStorm single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2019-05-17T15:21:15+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-07T04:52:42+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/37293012\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/37293012\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development\",\"datePublished\":\"2019-05-17T15:21:15+00:00\",\"dateModified\":\"2023-02-07T04:52:42+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/37293012\\\/NEWS\\\/\"},\"wordCount\":259,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Electronics\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/37293012\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/37293012\\\/NEWS\\\/\",\"name\":\"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development - Electronic Device Failure Analysis Society\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\"},\"datePublished\":\"2019-05-17T15:21:15+00:00\",\"dateModified\":\"2023-02-07T04:52:42+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/37293012\\\/NEWS\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/37293012\\\/NEWS\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/37293012\\\/NEWS\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#website\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"name\":\"Electronic Device Failure Analysis Society\",\"description\":\"Electronic Device Failure Analysis Society\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\",\"name\":\"Electronic Device Failure Analysis Society\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"contentUrl\":\"https:\\\/\\\/cdn-prd-main.asm-media.cloud\\\/uploads\\\/sites\\\/41\\\/2022\\\/10\\\/layout_set_logo.png\",\"width\":360,\"height\":95,\"caption\":\"Electronic Device Failure Analysis Society\"},\"image\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#\\\/schema\\\/logo\\\/image\\\/\"}},{\"@type\":\"Person\",\"@id\":\"\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/author\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development - Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development - Electronic Device Failure Analysis Society","og_description":"Veeco Instruments Inc., Plainview, N.Y., announces that SkyWater Technology Foundry has taken delivery of the WaferStorm single wafer wet process system to support advanced development work for the design and fabrication of next-generation 3D monolithic System-on-a-Chip (3DSoC) technology.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2019-05-17T15:21:15+00:00","article_modified_time":"2023-02-07T04:52:42+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/"},"author":{"name":"","@id":""},"headline":"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development","datePublished":"2019-05-17T15:21:15+00:00","dateModified":"2023-02-07T04:52:42+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/"},"wordCount":259,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Electronics","news","News Articles"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/","name":"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2019-05-17T15:21:15+00:00","dateModified":"2023-02-07T04:52:42+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/37293012\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"SkyWater selects Veeco\u2019s Waferstorm for 3D monolithic system-on-a-chip development"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/3845","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63082"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=3845"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/3845\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=3845"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=3845"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=3845"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}