{"id":3877,"date":"2019-02-18T04:07:59","date_gmt":"2019-02-18T04:07:59","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/36550465\/NEWS\/"},"modified":"2023-02-07T04:52:44","modified_gmt":"2023-02-07T04:52:44","slug":"ultra-tec-introduces-expanded-software-toolkit-and-interactive-graphics-for-ic-processing","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/36550465\/NEWS\/","title":{"rendered":"Ultra Tec introduces expanded software toolkit and interactive graphics for IC processing"},"content":{"rendered":"<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\"><span style=\"font-size:12.0pt\">Ultra Tec Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station. The new software tools enable profiling and processing of curved and warped surfaces seen in the wide array of today\u2019s packaged IC devices. These new adaptive techniques build on ASAP-1 In Situ\u2019s unique built-in through-thickness (RST) spectrometer. <\/span><\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\"><span style=\"font-size:12.0pt\">In addition to offering a new interactive graphical approach for modeling curvature profiles in both X and Y planes, high resolution mesh models can also be added to the profile to both fine-tune ultimate uniformity and produce high-yield polishing results. This suits applications such as ultrathinning for VLP, SIL lens, FIB, and emission microscopy, as well as for accurate decap for stacked-die and other multi-chip usage cases. <\/span><\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\"><span style=\"font-size:12.0pt\">Further to the adaptive modeling capabilities, Asap-1 In Situ now adds an in-line optical microscope capability &#8212; enabling the engineer to monitor and control all aspects of sample prep on the machine, without the need for sample transfer to external imaging and measurement tools &#8212; from start-to-end of the prep process.<\/span><\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\"><span style=\"font-size:12.0pt\">The photo shows \u201cThe Fire Inside &#8212; Visible light-illuminated view of a backside ultrathinned flip chip, showing emerging circuitry,&#8221; by Tim Hazeldine, Ultra Tec VP Sales &amp; Marketing. The photo won First &nbsp;Place in the Color Images Category in the EDFAS 2018 Photo Competition<\/span><\/span><\/p>\n<p style=\"margin-bottom:.0001pt\">&nbsp;<\/p>\n<p style=\"margin-bottom:.0001pt\"><span style=\"line-height:normal\"><span style=\"font-size:12.0pt\"><a href=\"http:\/\/www.ultratecusa.com\">www.ultratecusa.com<\/a><\/span><\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Ultra Tec Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,435,436,1],"tags":[],"class_list":["post-3877","post","type-post","status-publish","format-standard","hentry","category-electronics","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - 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