{"id":3913,"date":"2018-11-08T12:11:48","date_gmt":"2018-11-08T12:11:48","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/35747533\/NEWS\/"},"modified":"2023-02-07T04:52:47","modified_gmt":"2023-02-07T04:52:47","slug":"istfa-2018-conference-summary-and-highlights","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/35747533\/NEWS\/","title":{"rendered":"ISTFA 2018 Conference summary and highlights"},"content":{"rendered":"

Two weeks ago, ASM Events coordinated the International Symposium for Testing and Failure Analysis (ISTFA) in Phoenix, co-located with IEEE International Test Conference (ITC). The event drew 944 attendees and included 118 exhibitor booths, with the total attendance of both events over 1800. ISTFA exceeded its 2017 attendance record by 80 people. <\/span><\/span><\/p>\n

Saturday<\/strong> the conference kicked off with three education courses: <\/span><\/span><\/p>\n

\u2014 Failure Analysis of Electronic Devices<\/span><\/span><\/p>\n

\u2014 Fault Isolation Techniques for Failure Analysis<\/span><\/span><\/p>\n

\u2014 Beam-Based Defect Localization<\/span><\/span><\/p>\n

 <\/p>\n

Sunday<\/strong> continued with five tutorial topics:<\/span><\/span><\/p>\n

\u2014 Package and Physical Analysis Challenges Tutorials<\/span><\/span><\/p>\n

\u2014 Microscopy Tutorials<\/span><\/span><\/p>\n

\u2014 Electrical and Yield I Tutorials<\/span><\/span><\/p>\n

\u2014 Fault Isolation Tutorials<\/span><\/span><\/p>\n

\u2014 Featured Tutorials<\/span><\/span><\/p>\n

 <\/p>\n

In addition, a focus group on content development and the EDFA journal\/magazine staff held meetings that evening.<\/span><\/span><\/p>\n

Monday <\/strong>opened with the EDFAS general membership meeting and opening sessions, then the comprehensive technical programming continued throughout the day. Monday evening the Tools of the Trade Tour was an overwhelming success with 11 companies participating and over 140 attendees. AND\u2026\u2026\u2026\u2026Monday was not over yet \u2014 the social event was held at Lucky Strike, where attendees enjoyed a variety of games, bowling, networking, dinner, and cocktails to end a very successful day. <\/span><\/span><\/p>\n

The rest of the week <\/strong>was busy with two Keynote presentations, dedicated exhibit hours, a joint exposition with an exhibitor reception with ITC, programming, tutorials, panel sessions, user groups, and the poster and video contests with dessert reception on the expo floor. <\/span><\/span><\/p>\n

www.asminternational.org\/web\/istfa-2018  <\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Two weeks ago, ASM Events coordinated the International Symposium for Testing and Failure Analysis (ISTFA) in Phoenix, co-located with the IEEE International Test Conference (ITC).<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[446,434,438,435,436,1],"tags":[],"class_list":["post-3913","post","type-post","status-publish","format-standard","hentry","category-consumer-products","category-electronics","category-nanotechnology","category-news","category-news-articles","category-uncategorized"],"yoast_head":"\nISTFA 2018 Conference summary and highlights - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/35747533\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ISTFA 2018 Conference summary and highlights - 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