{"id":3972,"date":"2017-06-18T21:33:57","date_gmt":"2017-06-18T21:33:57","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27432333\/NEWS\/"},"modified":"2023-02-07T04:52:51","modified_gmt":"2023-02-07T04:52:51","slug":"optical-silicone-binder-extends-thermal-stability-to-180c-for-chip-scale-led-packaging","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27432333\/NEWS\/","title":{"rendered":"Optical silicone binder extends thermal stability to >180\u00b0C for chip-scale LED packaging"},"content":{"rendered":"<p>\n\tDow Corning, Midland, Mich., introduces Dow Corning CL-1000 optical silicone binder, a more thermally stable, high-refractive-index material that is formulated to expand design options for high-power chip-scale LED packaging (CSP). The latest addition to the company&#8217;s portfolio of advanced solutions for LED lighting, CL-1000 Binder offers best-in-class thermal stability and is optimized for compression molding processes. Available only in China, it leverages the same phenyl silicone chemistry as Dow Corning&#8217;s other industry-leading high RI optical encapsulants. This can help optimize the efficiency of next-generation LED lighting designs without costly investments in more powerful LED dies.<\/p>\n<p>\n\t<span style=\"font-family: Helvetica, Arial, sans-serif; font-size: 0.9375em; font-weight: 400;\">&#8220;The growing adoption of chip-scale&nbsp;packaging&nbsp;is enabling lighting designs that pack increasing numbers of LED dies more densely together in smaller form factors,&#8221; said Takuhiro Tsuchiya, global marketing manager at Dow Corning. &#8220;CL-1000 Optical Silicone Binder is Dow Corning&#8217;s response to the rapidly rising temperatures within these emerging applications. A more thermally stable iteration of our high-RI optical materials, this new product is formulated specifically to help enhance the robustness of high-power CSP designs.&#8221;<\/span><\/p>\n<p>\n\tValidated through Dow Corning&#8217;s testing, its thermal stability enables it to exhibit lower degradation and improved maintenance of mechanical properties vs. other high-RI silicone encapsulants after 2000 hours exposure to temperatures above 180\u00b0C. The new high-RI material also delivers excellent photo-stability with high clarity to further support reliable performance over the life of LED devices.<\/p>\n<p>\n\tThe CL-1000 Binder demonstrates good conformance with highly reflective Dow Corning WR-3001 and WR-3100 Die Edge Coat materials, enabling CSP packaging with enhanced reliability over longer periods. The product&#8217;s high Shore D60 hardness also enables LED packaging to withstand dicing operations.<\/p>\n<p>\n\t<a href=\"http:\/\/www.dowcorning.com\/\">www.dowcorning.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Dow Corning, Midland, Mich., introduces Dow Corning CL-1000 optical silicone binder, a new, more thermally stable, high-refractive-index material that is formulated to expand design options for high-power chip-scale LED packaging (CSP).<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-3972","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - 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