{"id":3998,"date":"2017-04-24T15:10:47","date_gmt":"2017-04-24T15:10:47","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/"},"modified":"2023-02-07T04:52:53","modified_gmt":"2023-02-07T04:52:53","slug":"suss-microtec-launches-automated-permanent-wafer-bonding-system","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/","title":{"rendered":"SUSS MicroTec launches automated permanent wafer bonding system"},"content":{"rendered":"<p>\n\tSUSS MicroTec, Germany, has launched the XBS200 automated permanent wafer bonding system designed for aligned wafer bonding of wafer sizes up to 200 mm. Its versatility and modular design offer maximum process flexibility in all permanent bonding tasks. A novel aligned wafer transfer method eliminates the complexity of traditional systems and offers consistent process results with excellent system availability.<\/p>\n<p>\n\tThe XBS200 platform provides low cost of ownership for high-volume production of MEMS, LED and 3D stacked devices. Its new bond aligner uses SUSS MicroTec&#8217;s proprietary Inter-Substrate Alignment (ISA) technology and delivers consistent submicron alignment. Automated calibration and overlay verification ensures optimum repeatability.<\/p>\n<p>\n\tThe bond chamber is based on the very successful stand-alone XB8 bonder. It offers a wide parameter window with temperatures of up to 550\u00b0C and bond forces of up to 100kN. Its innovative mechanical and thermal chamber design results in optimal bonding force and temperature distribution across the wafer, and thereby ensures high yield.<\/p>\n<p>\n\t&#8220;With the development of the new XBS200 platform, SUSS MicroTec enters the attractive market for automated permanent bonding systems. The XBS200 is based on our successful temporary bonding equipment platform and was designed according to the needs and demands of our customers&#8221;, says Stefan Lutter, General Manager of the bonder product line. &#8220;The XBS200 offers high throughput along with a small footprint, high alignment accuracy and repeatability as well as excellent temperature and bond force uniformity for maximum yield.&#8221;<\/p>\n<p>\n\t<a href=\"http:\/\/public-cockpit.eqs.com\/cgi-bin\/fncls.ssp?fn=redirect&amp;url=18df489ce96714d3cc4a5f463ca3755d&amp;application_id=553297&amp;site_id=news_data&amp;application_name=news\" target=\"_blank\" rel=\"noopener\">www.suss.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>SUSS MicroTec, Germany, has launched the XBS200 automated permanent wafer bonding system designed for aligned wafer bonding of wafer sizes up to 200 mm.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-3998","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>SUSS MicroTec launches automated permanent wafer bonding system - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"SUSS MicroTec launches automated permanent wafer bonding system - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"SUSS MicroTec, Germany, has launched the XBS200 automated permanent wafer bonding system designed for aligned wafer bonding of wafer sizes up to 200 mm.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2017-04-24T15:10:47+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-07T04:52:53+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/27327169\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/27327169\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"SUSS MicroTec launches automated permanent wafer bonding system\",\"datePublished\":\"2017-04-24T15:10:47+00:00\",\"dateModified\":\"2023-02-07T04:52:53+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/27327169\\\/NEWS\\\/\"},\"wordCount\":247,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Electronics\",\"general\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/27327169\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/27327169\\\/NEWS\\\/\",\"name\":\"SUSS MicroTec launches automated permanent wafer bonding system - 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Electronic Device Failure Analysis Society","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/","og_locale":"en_US","og_type":"article","og_title":"SUSS MicroTec launches automated permanent wafer bonding system - Electronic Device Failure Analysis Society","og_description":"SUSS MicroTec, Germany, has launched the XBS200 automated permanent wafer bonding system designed for aligned wafer bonding of wafer sizes up to 200 mm.","og_url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/","og_site_name":"Electronic Device Failure Analysis Society","article_published_time":"2017-04-24T15:10:47+00:00","article_modified_time":"2023-02-07T04:52:53+00:00","twitter_card":"summary_large_image","twitter_misc":{"Written by":"","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/#article","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/"},"author":{"name":"","@id":""},"headline":"SUSS MicroTec launches automated permanent wafer bonding system","datePublished":"2017-04-24T15:10:47+00:00","dateModified":"2023-02-07T04:52:53+00:00","mainEntityOfPage":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/"},"wordCount":247,"publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"articleSection":["Electronics","general","news","News Articles"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/","url":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/","name":"SUSS MicroTec launches automated permanent wafer bonding system - Electronic Device Failure Analysis Society","isPartOf":{"@id":"https:\/\/www.asminternational.org\/edfas\/#website"},"datePublished":"2017-04-24T15:10:47+00:00","dateModified":"2023-02-07T04:52:53+00:00","breadcrumb":{"@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/27327169\/NEWS\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.asminternational.org\/edfas\/"},{"@type":"ListItem","position":2,"name":"SUSS MicroTec launches automated permanent wafer bonding system"}]},{"@type":"WebSite","@id":"https:\/\/www.asminternational.org\/edfas\/#website","url":"https:\/\/www.asminternational.org\/edfas\/","name":"Electronic Device Failure Analysis Society","description":"Electronic Device Failure Analysis Society","publisher":{"@id":"https:\/\/www.asminternational.org\/edfas\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.asminternational.org\/edfas\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.asminternational.org\/edfas\/#organization","name":"Electronic Device Failure Analysis Society","url":"https:\/\/www.asminternational.org\/edfas\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/","url":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","contentUrl":"https:\/\/cdn-prd-main.asm-media.cloud\/uploads\/sites\/41\/2022\/10\/layout_set_logo.png","width":360,"height":95,"caption":"Electronic Device Failure Analysis Society"},"image":{"@id":"https:\/\/www.asminternational.org\/edfas\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"","url":"https:\/\/www.asminternational.org\/edfas\/author\/"}]}},"acf":[],"_links":{"self":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/3998","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/users\/63082"}],"replies":[{"embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/comments?post=3998"}],"version-history":[{"count":0,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/posts\/3998\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/media?parent=3998"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/categories?post=3998"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.asminternational.org\/edfas\/wp-json\/wp\/v2\/tags?post=3998"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}