\n\tQualcomm Inc., San Diego, Calif., and TDK Corp., Tokyo, announce the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE Ltd. The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things, automotive applications, connected computing, and more. The business being transferred constitutes a part of the TDK SAW Business Group activities.<\/p>\n
\n\t“The ongoing expansion of mobile communication across multiple industries, and the unprecedented deployment of multi-carrier 4G technologies now reaching over sixty-five 3GPP frequency bands are driving manufacturers of wireless solutions to higher levels of miniaturization, integration, and performance, especially for the RFFE in these devices,” said Cristiano Amon, executive vice president, Qualcomm Technologies Inc., and president of QCT. “Further, 5G will increase the level of complexity even more. To that end, the ability to provide the ecosystem a truly complete solution is essential to enabling our customers to deliver mobile solutions at scale and on time.”<\/p>\n
\n\tTogether with RF360 Holdings, Qualcomm Technologies Inc. (QTI) will be ideally positioned to design and supply products with end-to-end performance and global scale from the modem\/transceiver all the way to the antenna in a fully integrated system.<\/p>\n
\n\tRF360 Holdings will have a comprehensive set of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW), to support the wide range of frequency bands being deployed in networks across the globe. Moreover, RF360 Holdings will enable the delivery of RFFE modules from QTI that will include front-end components designed and developed by QTI. These components include CMOS, SOI and GaAs Power Amplifiers, a broad portfolio of Switches, Antenna Tuning, Low Noise Amplifiers (LNAs) and the industry’s leading Envelope Tracking solution.<\/p>\n
\n\tIn addition to operating the joint venture, Qualcomm and TDK will deepen their technological cooperation to cover a wide range of cutting-edge technologies for next-generation mobile communications, IoT and automotive applications.<\/p>\n