\n\tFuture Market Insights (FMI), Valley Cottage, N.Y., releases its latest report on the semiconductor assembly and testing services market, predicting that it will primarily be driven by the surging demand for high-end packaging solutions. The global semiconductor assembly and testing services market possibly reached a value of $ 24.72 billion by the end of 2016. Asia Pacific will remain the most attractive market for semiconductor assembly and testing services.<\/p>\n
\n\tIncreased demand for outsourced SATS or OSAT services will favor the growth of the global SATS market. With the rapidly thriving consumer electronics industry, the demand for connectivity and mobility is also on the rise, which is foreseen to be an important booster to the demand for connected devices, eventually fostering the semiconductor assembly and testing services market.<\/p>\n
\n\tRising adoption of multimedia technology devices is another factor bolstering the demand for SATS. A number of SATS providers offer value added services, such as in-house testing and high-end packaging, which will remain an important driver to market growth. Several integrated design manufacturers are increasingly prioritizing semiconductor assembly and testing services as a time-efficient alternative.<\/p>\n
\n\tDue to higher costs associated with larger wafer fabrication factories, manufacturers are largely inclined toward outsourcing semiconductor assembly and testing services to third party providers. Leading fabless companies will continue to outsource everything, including testing, assembly, and packaging of semiconductor. This will favor market growth. Rising adoption of automotive electronics and promising emergence of next-generation electronic vehicles are likely to boost the market growth further.<\/p>\n