\n\tAmkor Technology Inc., Tempe, Ariz., announces completion of product qualification for its innovative silicon wafer integrated fan-out technology, which is designed to handle the demanding requirements of today’s advanced mobile, networking, and system-in-package applications. <\/p>\n
\n\tWith its fine-feature photolithography and thin film dielectrics, silicon wafer integrated fan-out technology (Swift) bridges the gap between through silicon via and traditional wafer level fan-out packages. Compared to laminate-based substrate technologies, Swift offers significant improvements in form factor, signal integrity, power distribution, and thermal performance. It incorporates an “RDL first” process that allows wafers to be built and yielded ahead of the assembly process, thus accelerating production cycles and optimizing overall assembly yield.<\/p>\n
\n\t“The semiconductor industry requires much higher levels of integration in a significantly reduced form factor,” says Ron Huemoeller, Amkor’s corporate vice president, Research & Development. “Completing the product qualification stage of Swift is an important milestone. We achieved success by leveraging our significant fan-out development experience and using our existing cutting-edge equipment. Our package and board-level reliability results demonstrate that Swift is ready for sampling by customers.”<\/p>\n
\n\tSwift was named the “Device of the Year” at the 3D InCites Awards ceremony earlier this year. It was recognized for being “uniquely developed to deliver a high yielding, high-performance package with the thinnest profile in the industry.” It was also noted for its ability to deliver 2\u00b5m line\/space lithography (with up to four layers of RDL) and a very dense network of memory interface vias at a very competitive price.<\/p>\n
\n\tSwift is targeted for production in the second half of 2017 at K5, Amkor’s state-of-the-art manufacturing, research and development center in Incheon, South Korea.<\/p>\n