{"id":4063,"date":"2016-11-13T20:32:10","date_gmt":"2016-11-13T20:32:10","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26960879\/NEWS\/"},"modified":"2023-02-07T04:52:58","modified_gmt":"2023-02-07T04:52:58","slug":"suss-microtec-launches-coat-and-develop-solution-for-advanced-packaging","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26960879\/NEWS\/","title":{"rendered":"Suss MicroTec launches coat and develop solution for advanced packaging"},"content":{"rendered":"<p>\n\tSuss MicroTec, Germany, has launched a new generation of its fully automated ACS300 Gen3&nbsp; platform specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip scale packaging, fan-out wafer-level packaging, copper pillar flip-chip, and 3D packaging.<\/p>\n<p>\n\tThe tool addresses the needs of a highly competitive and cost-sensitive market. Efficient module stacking allows the smallest footprint for a system with eight coaters and developers on the market, saving costly cleanroom space. The three-level modular system delivers high yield and throughput by fast and precise robots, intelligent scheduling algorithms, and a highly advanced monitoring system.<\/p>\n<p>\n\tThe ACS300 Gen3 provides for simultaneous 200 mm and 300 mm wafer processing without the need for a mechanical changeover. In addition, the tool can be equipped to handle 330 mm and warped wafers with a warpage of up to 10 mm. The ability to process multiple wafer shapes and sizes as well as various coat and develop materials makes the platform an efficient all-in-one solution. State-of-the-art chemical-saving features address economic as well as ecological concerns, working in line with even the most rigid sustainability standards.<\/p>\n<p>\n\t&#8220;The ACS300 Gen3 is our new flagship for the advanced packaging market,&#8221; says Gary Choquette, General Manager of the Coater\/Developer product line. &#8220;The ACS300 Gen3 stands for high process stability, repeatability, and yield. For example, it has more sensors for logging and control than any coating system Suss MicroTec has ever produced.&#8221;<\/p>\n<p>\n\t<a href=\"http:\/\/www.suss.com\/\" style=\"font-family: Helvetica, Arial, sans-serif; font-size: 0.9375em;\">www.suss.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Suss MicroTec, Germany, has launched its new generation of the fully automated ACS300 Gen3  platform specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip scale packaging, fan-out wafer-level packaging, copper pillar flip-chip, and 3D packaging.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-4063","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - 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