{"id":4113,"date":"2016-07-25T21:46:12","date_gmt":"2016-07-25T21:46:12","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26712343\/NEWS\/"},"modified":"2023-02-07T04:53:02","modified_gmt":"2023-02-07T04:53:02","slug":"helios-pfib-enables-advanced-failure-analysis-of-semiconductors","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26712343\/NEWS\/","title":{"rendered":"Helios PFIB enables advanced failure analysis of semiconductors"},"content":{"rendered":"<p>\n\tFEI Co., Hillsboro, Ore., offers the Helios PFIB, said to be the world&#8217;s most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages.<\/p>\n<p>\n\tThe Helios PFIB system combines the innovative Helios Elstar with UC technology electron column for high-resolution, high-contrast imaging. Its high-performance Vion Xenon plasma ion column provides fast and precise large area sample cross-sectioning and deprocessing. Combined with FEI&#8217;s proprietary Si Trenching, Dx and DE chemistries offer a unique Deprocess\/Delayering solution for Electrical Fault Isolation of latest process technology devices. The Helios PFIB also offers optional Navigation and Inspection capabilities, such as infrared\/visible light microscope and analytical capabilities such as EBSD and EDX.<\/p>\n<p>\n\tThe Helios PFIB DualBeam features FEI&#8217;s most recent advances in Plasma Focused Ion Beam and field emission SEM (FESEM) technologies and their combined use. FEI&#8217;s first plasma-based DualBeam is designed for high-throughput, large-volume processing, combined with extreme high-resolution imaging in both 2D and 3D. For large-scale cross-sectioning, large-volume 3D data collection, or large-scale patterning, the Helios Plasma FIB DualBeam provides the highest quality of data in the shortest time.<\/p>\n<p>\n\t<a href=\"http:\/\/www.fei.com\/\">www.FEI.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n<p>\n\t&nbsp;<\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>FEI Co., Hillsboro, Ore., offers the Helios PFIB, said to be the world&#8217;s most advanced DualBeam Plasma FIB platform for large area deprocessing to enable electrical fault isolation of advanced process ICs and advanced failure analysis of 3D packages.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,438,435,436,1],"tags":[],"class_list":["post-4113","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-nanotechnology","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - 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