{"id":4150,"date":"2016-04-28T14:13:22","date_gmt":"2016-04-28T14:13:22","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26282619\/NEWS\/"},"modified":"2023-02-07T04:53:05","modified_gmt":"2023-02-07T04:53:05","slug":"tescan-presents-may-4-webinar-on-failure-analysis-of-microelectronic-devices","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26282619\/NEWS\/","title":{"rendered":"Tescan presents May 4 webinar on \u201cFailure Analysis of Microelectronic Devices\u201d"},"content":{"rendered":"<p>\n\tTescan, Czechoslovakia, will present a webinar on &#8220;Failure analysis of Microelectronic Devices&#8221; Wednesday May 4 at 9 am EDT. In this&nbsp;webinar, recent achievements in advanced failure analysis in state-of-the-art microelectronic devices will be presented.<\/p>\n<p>\n\tThe presentation is divided into two parts. The first part will include FA results on integrated circuits based on state-of-the-art 14-nm node technology. The focus will be on well-controlled orthogonal and planar IC delayering using gas-assisted Xe plasma FIB etching<\/p>\n<p>\n\t<span style=\"font-family: Helvetica, Arial, sans-serif; font-size: 0.9375em; font-weight: 400; line-height: 1.33333em;\">The second part will cover FA results on advanced packaging technologies using Xe plasma FIB. It will show how TEM lamellae are prepared with Ga and Xe plasma FIB. Particular attention will be paid to the preparation of front- and back-side artifact-free lamellae.<\/span><\/p>\n<p>\n\tCross-sections with dimensions exceeding 100 \u00b5m will be demonstrated, emphasizing the mitigation of FIB artifacts using the proprietary Rocking stage technology and special masking methods. These approaches allow for processing of even the most challenging packages.<\/p>\n<p>\n\t<a href=\"http:\/\/www.tescan.com\/\" style=\"font-family: Helvetica, Arial, sans-serif; font-size: 0.9375em; line-height: 1.33333em;\">www.tescan.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Tescan, Czechoslovakia, will present a webinar on &#8220;Failure analysis of Microelectronic Devices&#8221; Wednesday May 4 at 9 am EDT.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-4150","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Tescan presents May 4 webinar on \u201cFailure Analysis of Microelectronic Devices\u201d - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26282619\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tescan presents May 4 webinar on \u201cFailure Analysis of Microelectronic Devices\u201d - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Tescan, Czechoslovakia, will present a webinar on &quot;Failure analysis of Microelectronic Devices&quot; Wednesday May 4 at 9 am EDT.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26282619\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2016-04-28T14:13:22+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-07T04:53:05+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/26282619\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/26282619\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"Tescan presents May 4 webinar on \u201cFailure Analysis of Microelectronic Devices\u201d\",\"datePublished\":\"2016-04-28T14:13:22+00:00\",\"dateModified\":\"2023-02-07T04:53:05+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/26282619\\\/NEWS\\\/\"},\"wordCount\":166,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Electronics\",\"general\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/26282619\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/26282619\\\/NEWS\\\/\",\"name\":\"Tescan presents May 4 webinar on \u201cFailure Analysis of Microelectronic Devices\u201d - 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