{"id":4205,"date":"2016-01-20T16:43:16","date_gmt":"2016-01-20T16:43:16","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26115203\/NEWS\/"},"modified":"2023-02-07T04:53:09","modified_gmt":"2023-02-07T04:53:09","slug":"qualcomm-and-tdk-to-jointly-develop-rffe-modules-and-rf-filters-into-integrated-systems","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26115203\/NEWS\/","title":{"rendered":"Qualcomm and TDK to jointly develop RFFE modules and RF filters into integrated systems"},"content":{"rendered":"<p>\n\tQualcomm Inc., San Diego, Calif., and TDK Corp., Tokyo, &nbsp;have agreed to form a joint venture under the name RF360 Holdings Singapore PTE. Ltd., to develop RF front-end (RFFE) modules and RF filters into fully integrated systems.<\/p>\n<p>\n\t<span style=\"font-family: Helvetica, Arial, sans-serif; font-size: 0.9375em; font-weight: 400; line-height: 1.33333em;\">These products are for mobile devices and business segments such as Internet of Things, drones, robotics, automotive applications, and more. The joint venture will draw upon TDK&#8217;s capabilities in micro-acoustic RF filtering, packaging, and module integration technologies; and Qualcomm&#8217;s expertise in advanced wireless technologies, to serve customers with leading-edge RF solutions into fully integrated systems.<\/span><\/p>\n<p>\n\tIn addition to creating RF360 Holdings, Qualcomm and TDK will expand their collaboration around key technology fields, including sensors and wireless charging.<\/p>\n<p>\n\tThe agreement is subject to receipt of regulatory approvals and other closing conditions and is expected to close by early 2017.<\/p>\n<p>\n\t&#8220;TDK is a leading electronic components manufacturer with cutting-edge expertise in RF filters and modules, and we are looking forward to deepening our collaboration and together accelerating innovation and better serving the ecosystem for next-generation mobile communications,&#8221; said Steve Mollenkopf, CEO of Qualcomm. &#8220;The joint venture&#8217;s RF filters will bolster Qualcomm RF360 front-end solutions to enable Qualcomm Technologies Inc. (QTI) to deliver a truly complete solution to the ecosystem. This will enable us to expand our growth opportunity by allowing us to accelerate our strategy to provide OEMs across our business segments with fully integrated systems that will enable them to deliver at scale and on an accelerated timeframe.&#8221;<\/p>\n<p>\n\t&#8220;The joint venture with Qualcomm is a win for both companies, which complement each other ideally,&#8221; said Mr. Takehiro Kamigama, President and CEO of TDK. &#8220;Customers will benefit from our unique and comprehensive portfolio, which will further strengthen TDK&#8217;s position in key growth business segments and open new and exciting business opportunities. In this context, it was a major objective to ensure that our customers can continue to expect a seamless supply of discrete filters and duplexers, as well as modules.&#8221;<\/p>\n<p>\n\t<a href=\"http:\/\/www.qualcomm.com\/\">www.qualcomm.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Qualcomm Inc., San Diego, Calif., and TDK Corp., Japan,  have agreed to form a joint venture under the name RF360 Holdings Singapore PTE. Ltd. develop RF front-end (RFFE) modules and RF filters into fully integrated systems.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[443,434,450,435,436,1],"tags":[],"class_list":["post-4205","post","type-post","status-publish","format-standard","hentry","category-automobiles-and-ground-transportation","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Qualcomm and TDK to jointly develop RFFE modules and RF filters into integrated systems - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/26115203\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Qualcomm and TDK to jointly develop RFFE modules and RF filters into integrated systems - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Qualcomm Inc., San Diego, Calif., and TDK Corp., Japan, have agreed to form a joint venture under the name RF360 Holdings Singapore PTE. 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