{"id":4307,"date":"2015-05-26T01:26:25","date_gmt":"2015-05-26T01:26:25","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/25459025\/NEWS\/"},"modified":"2023-02-07T04:53:16","modified_gmt":"2023-02-07T04:53:16","slug":"silver-sinter-paste-for-power-semiconductors-has-strong-adhesion-to-copper","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/25459025\/NEWS\/","title":{"rendered":"Silver sinter paste for power semiconductors has strong adhesion to copper"},"content":{"rendered":"<p>\n\tKyocera America Inc., San Diego, announces the U.S. introduction of its XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver higher performance than high-lead solders. The lead-free, pressureless paste exhibits excellent thermal and electrical performance, plus strong adhesion to bare copper, making it ideal for high-reliability applications such as power semiconductors, automotive modules, and high-brightness LEDs.<\/p>\n<p>\n\t&#8220;High-power devices such as insulated-gate bipolar transistors (IGBTs), LED power sources, and automotive modules have hit a performance ceiling due to the limited thermal dissipation offered by traditional power die attach materials,&#8221; says Bob Whisler, president of Kyocera America Inc. &#8220;Kyocera&#8217;s Silver Sinter Paste is the solution that will help drive technology to the next level by enabling customers to overcome ongoing technical hurdles and maximize package performance.&#8221;<\/p>\n<p>\n\tBased on nano-silver technology, the paste demonstrates thermal conductivity of more than 200 W\/mK, and excellent die-shear adhesion to bare copper, and silver- and gold-plated surfaces. Compared to standard solders and electrically conductive die-attach pastes, Silver Sinter Paste offers more than three times the thermal conductivity. Moreover, through the utilization of a novel resin-dispersion system, the paste shows excellent interface reliability in the most demanding applications.<\/p>\n<p>\n\tThe material offers a low-temperature, pressureless silver solder option that enhances the performance of high-power semiconductor devices such as gallium nitride and silicon carbide.<\/p>\n<p>\n\t<a href=\"http:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.kyocera-chemi.jp%2Fenglish%2F&amp;esheet=51105023&amp;newsitemid=20150518006334&amp;lan=en-US&amp;anchor=http%3A%2F%2Fwww.kyocera-chemi.jp%2Fenglish%2F&amp;index=2&amp;md5=18a72599bc68bb79c2a1e5092d4895be\" target=\"_blank\" rel=\"noopener\">http:\/\/www.kyocera-chemi.jp\/english\/<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Kyocera America Inc., San Diego, announces the U.S. introduction of its XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver higher performance than high-lead solders.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,438,435,436,1],"tags":[],"class_list":["post-4307","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-nanotechnology","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - 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