{"id":4321,"date":"2015-04-19T21:08:03","date_gmt":"2015-04-19T21:08:03","guid":{"rendered":"https:\/\/staging.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/25026007\/NEWS\/"},"modified":"2023-02-07T04:53:17","modified_gmt":"2023-02-07T04:53:17","slug":"thin-porous-copper-sheets-transfer-five-times-more-heat-from-electronic-devices","status":"publish","type":"post","link":"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/25026007\/NEWS\/","title":{"rendered":"Thin porous copper sheets transfer five times more heat from electronic devices"},"content":{"rendered":"<p>\n\tFujitsu Laboratories, Japan, has reportedly developed the world&#8217;s first thin heat pipe designed for small electronic devices. It is a thin loop copper heat pipe less than one millimeter thick, based on technologies for stacking metal sheets. It is said to be capable of transferring approximately five times more heat than current thin heat pipes.<\/p>\n<p>\n\tThe evaporator contains a porous structure, with the numerous holes driving the fluid with capillary action. To achieve this action, engineers stacked together copper sheets 0.1 mm thick, to develop a structure containing minuscule pores. The pattern of holes etched into the sheets is such that the holes of each layer are slightly offset from the adjacent layers. When these sheets are stacked, capillary action causes the fluid to circulate.<\/p>\n<p>\n\tIn addition, by separating the vapor phase and liquid phase, there are two flows of the working fluid within the stacked structure, which enables efficient heat transfer. Furthermore, this technology can now be applied to mobile devices, because the liquid line that returns fluid to the evaporator operates on capillary action, enabling it to stably transfer heat regardless of orientation.<\/p>\n<p>\n\tBecause this loop heat pipe uses the heat from the heat source to power thermal transfer, without an external pump or other energy source, it does not increase the overall energy consumption.<\/p>\n<p>\n\tThis loop heat pipe uses copper sheets that are only 0.1 mm thick, with two surface sheets and four inner-layer sheets, for a total of six sheets. The previous, approximately 10 mm-thick evaporator of the loop heat pipe can now be reduced to 0.6 mm, enabling a heat-transfer device to be placed in compact mobile devices.<\/p>\n<p>\n\tCompared to previous thin heat pipes and material of highly thermally conductive sheets, this new device allows for approximately five times greater heat transfer. The new technology will allow CPUs and other parts to function at low temperatures while preventing heat concentration within localized areas. &nbsp;<\/p>\n<p>\n\t<a href=\"http:\/\/www.fujitsu.com\/\">www.fujitsu.com<\/a><\/p>\n<p>\n\t&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Fujitsu Laboratories, Japan, has reportedly developed the world&#8217;s first thin heat pipe designed for small electronic devices.<\/p>\n","protected":false},"author":63082,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[434,450,435,436,1],"tags":[],"class_list":["post-4321","post","type-post","status-publish","format-standard","hentry","category-electronics","category-general","category-news","category-news-articles","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Thin porous copper sheets transfer five times more heat from electronic devices - Electronic Device Failure Analysis Society<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/25026007\/NEWS\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Thin porous copper sheets transfer five times more heat from electronic devices - Electronic Device Failure Analysis Society\" \/>\n<meta property=\"og:description\" content=\"Fujitsu Laboratories, Japan, has reportedly developed the world&#039;s first thin heat pipe designed for small electronic devices.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.asminternational.org\/edfas\/results\/-\/journal_content\/56\/10192\/25026007\/NEWS\/\" \/>\n<meta property=\"og:site_name\" content=\"Electronic Device Failure Analysis Society\" \/>\n<meta property=\"article:published_time\" content=\"2015-04-19T21:08:03+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2023-02-07T04:53:17+00:00\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/25026007\\\/NEWS\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/25026007\\\/NEWS\\\/\"},\"author\":{\"name\":\"\",\"@id\":\"\"},\"headline\":\"Thin porous copper sheets transfer five times more heat from electronic devices\",\"datePublished\":\"2015-04-19T21:08:03+00:00\",\"dateModified\":\"2023-02-07T04:53:17+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/25026007\\\/NEWS\\\/\"},\"wordCount\":332,\"publisher\":{\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/#organization\"},\"articleSection\":[\"Electronics\",\"general\",\"news\",\"News Articles\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/25026007\\\/NEWS\\\/\",\"url\":\"https:\\\/\\\/www.asminternational.org\\\/edfas\\\/results\\\/-\\\/journal_content\\\/56\\\/10192\\\/25026007\\\/NEWS\\\/\",\"name\":\"Thin porous copper sheets transfer five times more heat from electronic devices - 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